Next Generation High Sensitivity Polymeric EUV Resists (2012–2015)
Photolithography is the basis of the multi-billion dollar integrated circuit industry. The continued success of the industry is due to the ability to project ever smaller images, and this is critically dependent on a thin layer of polymer, the polymer resist. The industry however has reached a critical juncture, where the size of the features being projected has become comparable to the size of defects inherent in the projection process. Therefore the continued success of the industry depends on new technologies to allow low-defect printing at 10-20 nm. In this project we will develop new classes of highly sensitive polymers with high fidelity of patterning for the next generation of resists.