Next generation flexible high current micro-electronic interconnects (2019–2022)
Because of economic and political pressure to reduce energy usage and the inclusion of smart functions in a wider range of applications, industry is searching for ways of reducing the process temperatures required for the
manufacture of electronic circuity. The objective of the research is to develop a low temperature assembly process for electronic circuitry based on the bonding properties of Ga and Ga alloys. The intention will be to take advantage of the unique properties of intermetallic compounds formed by controlled reactions between Ga and circuit substrate materials that offer the possibility of high reliability connections.