Dr Dongdong Qu

Postdoctoral Research Fellow

School of Mechanical and Mining Engineering
Faculty of Engineering, Architecture and Information Technology
d.qu1@uq.edu.au
+61 7 336 53730

Overview

Qualifications

  • PhD Materials Processing Engineering, Harbin Institute of Technology

Publications

  • Qu, Dong Dong, McDonald, Stuart D., Yasuda, Hideyuki, Ohara, Koji, Kohara, Shinji and Nogita, Kazuhiro (2018). Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction. In: Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir, Electronic Packaging Interconnect Technology. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, (101-106). 1-2 November 2017. doi:10.4028/www.scientific.net/SSP.273.101

  • Liu, Shi Qian, Qu, Dong Dong, McDonald, Stuart D. and Nogita, Kazuhiro (2018). The interaction of Sn-Ga alloys and Au coated Cu substrates. In: , , (3-8). . doi:10.4028/www.scientific.net/SSP.273.3

  • Li, Liangliang, Wang, Luhong, Li, Renfeng, Qu, Dongdong, Zhao, Haiyan, Chapman, Karena W. , Chupas, Peter J. and Liu, Haozhe (2017) Pressure-induced polyamorphism in lanthanide-solute metallic glasses. Physica Status Solidi, 11 6: 1700078. doi:10.1002/pssr.201700078

View all Publications

Publications

Journal Article

Conference Publication

  • Qu, Dong Dong, McDonald, Stuart D., Yasuda, Hideyuki, Ohara, Koji, Kohara, Shinji and Nogita, Kazuhiro (2018). Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction. In: Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir, Electronic Packaging Interconnect Technology. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, (101-106). 1-2 November 2017. doi:10.4028/www.scientific.net/SSP.273.101

  • Liu, Shi Qian, Qu, Dong Dong, McDonald, Stuart D. and Nogita, Kazuhiro (2018). The interaction of Sn-Ga alloys and Au coated Cu substrates. In: , , (3-8). . doi:10.4028/www.scientific.net/SSP.273.3