Dr Stuart McDonald

Senior Research Fellow

School of Mechanical and Mining Engineering
Faculty of Engineering, Architecture and Information Technology
s.mcdonald1@uq.edu.au
+61 7 336 57132

Overview

Dr McDonald is a graduate of The University of Queensland (UQ) having obtained a Bachelor of Engineering (Manufacturing and Materials) in 1997 and a PhD in Materials Engineering in 2002. He is a currently a Senior Research Fellow in the Nihon Superior Centre for the Manufacture of Electronic Materials (NSCMEM).

His research is in the field of microstructure control through solidification science and in particular on understanding the effect of trace element additions on nucleation and growth phenomena. He has numerous publications and expertise in the areas of:

1. Lead-free Solder Alloys

2. Grain refinement

3. Machining and heat treatment of titanium alloys

4. Mg-based Hydrogen Storage Alloys

5. Casting and Solidification of Al-Si Alloys

6. Eutectic solidification and modification

Research Interests

  • Eutectic Modification
  • Lead-Free Soldering
  • Grain Refinement
  • Solidification/Casting

Research Impacts

Dr McDonald has established the modifying elements, commonly used to alter the eutectic silicon morphology in Al-Si alloys dramatically alter the size and spatial distribution of individual eutectic colonies or ‘eutectic-grains’. It has since become accepted that research into modification mechanisms must consider the growth velocity of the etuectic interface as it relates to the size and number of eutectic grains.

He has been an advocate for the benefits of both eutectic and primary grain refinement, which can benefit many commercial foundry alloys and has contributed to the growing body of theoretical and computational modeling on eutectic and primary grain refinement. Commercially his research has been recognised with the following Patents.

Patents 1. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, G. Zeng, “Low temperature brazing alloys”, Japanese Patent Application No.2013-183232, 04/09/3013.

2. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, C. M. Gourlay, “Process for producing solder joint with improved reliability”, International Patent Application No: WO/2013/002112, 21/6/2012.

3. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, T. Ventura, “Solder alloy”, International Patent Application No: WO 2012/137901-A1, 11/10/2012.

4. A.K. Dahle, L. Lu, K. Nogita and S.D. McDonald, “Aluminium Casting Alloy”, International Patent Application No: WO 2006/058388, 2/12/2005.

Qualifications

  • Bachelor of Engineering, The University of Queensland
  • PhD, The University of Queensland

Publications

View all Publications

Grants

View all Grants

Publications

Journal Article

Conference Publication

  • Kim, Manjin, Ali, Yahia, McDonald, Stuart D., Abbott, Trevor B. and Nogita, Kazuhiro (2020). The Independent Effects of Cooling Rate and Na Addition on Hydrogen Storage Properties in Hypo-eutectic Mg Alloys. 149th TMS Annual Meeting & Exhibition, San Diego, CA, United States, 23-27 February 2020. Cham, Switzerland: Springer. doi: 10.1007/978-3-030-36647-6_43

  • Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart and Stjohn, David (2019). Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012009

  • Somidin, Flora, McDonald, Stuart, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012006

  • Somidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. NEW YORK: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733594

  • Abdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008

  • Tan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007

  • Nogita, K., Somidin, F., Mohd Salleh, M. A.A., Sweatman, K., Nishimura, T., McDonald, S. D., Maeno, H. and Matsumura, S. (2018). Effect of reflow conditions on the intermetallic layer in solder joints. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kuwana, Mie, Japan, 17 - 21 April 2018. Japan: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2018.8374678

  • Qu, Dong Dong, McDonald, Stuart D., Yasuda, Hideyuki, Ohara, Koji, Kohara, Shinji and Nogita, Kazuhiro (2018). Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.101

  • Xuan, Quy Tran, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart D. and Nogita, Kazuhiro (2018). Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , 1-2 November 2017 . Zurich, Switzerland : Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.9

  • Wong, Charlotte, Styles, Mark J., Zhu, Suming, Abbott, Trevor, Nogita, Kazuhiro, McDonald, Stuart D., StJohn, David H., Gibson, Mark A. and Easton, Mark A. (2018). Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce system. International Symposium on Magnesium Technology, 2018, Phoenix, AZ, USA, March 11, 2018-March 15, 2018. Springer International Publishing. doi: 10.1007/978-3-319-72332-7_13

  • Somidin, Flora, McDonald, Stuart and Nogita, Kazuhiro (2018). Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding. Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1-2 November 2017. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.14

  • Tan, Xin Fu, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart and Nogita, Kazuhiro (2018). Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys. Electronic Packaging Interconnect Technology Symposium, Fukuoka, Japan, 1-2 November 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/SSP.273.20

  • StJohn, David H., McDonald, Stuart D., Bermingham, Michael J., Mereddy, Sri, Prasad, Arvind and Dargusch, Matthew (2018). The challenges associated with the formation of equiaxed grains during additive manufacturing of titanium alloys. 4th International Conference on Powder Metallurgy of Titanium, PMTi 2017, Xian, China, 8-10 September 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/KEM.770.155

  • Liu, Shi Qian, Qu, Dong Dong, McDonald, Stuart D. and Nogita, Kazuhiro (2018). The interaction of Sn-Ga alloys and Au coated Cu substrates. 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1 - 2 November 2017. Pfaffikon, Switzerland: Scientific.Net. doi: 10.4028/www.scientific.net/SSP.273.3

  • Nogita, K., Salleh, M. A. A. Mohd, Smith, S., Wu, Y. Q., McDonald, S. D., Ab Razak, A. G., Akaiwa, T. and Nishimura, T. (2017). Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects. 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Japan, 19 - 22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2017.7939399

  • Nogita, K., Salleh, M. A. A. Mohd, Zeng, G., McDonald, S. D., Gourlay, C. and Yasuda, H. (2017). Real time X-ray imaging of soldering processes at the SPring-8 synchrotron. International Conference on Electronics Packaging (ICEP), Tendo, Japan, 19-22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers . doi: 10.23919/ICEP.2017.7939343

  • Zeng, G., Nogita, K., Belyakov, S., Xian, J. W., McDonald, S. D., Yang, K. V., Yasuda, H. and Gourlay, C. M. (2017). Real-time observation of AZ91 solidification by synchrotron radiography. Magnesium Technology 2017, San Diego, CA, United States, 26 February - 2 March 2017. Cham, Switzerland: Springer. doi: 10.1007/978-3-319-52392-7_82

  • Nogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49

  • Smith, S., Zeng, G., Read, J., McDonald, S. D. and Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.58

  • Nogita, K., Kefford, B., Read, J. and McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.53

  • Darlapudi, A., McDonald, S.D. and St John, D.H. (2016). The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys. 4th International Conference on Advances in Solidification Processes, ICASP 2014, Windsor, United Kingdom, July 8-11, 2014. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/117/1/012022

  • Prasad, A., Liotti, E., McDonald, S. D., Nogita, K., Yasuda, H., Grant, P. S. and StJohn, D. H. (2015). Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling. 14th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes, Awaji island, Hyogo, Japan, 21-26 June 2015. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/84/1/012014

  • Ng, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122

  • Zeng, Guang, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2014). Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics. 2014 International Conference on Electronics Packaging (ICEP 2014), Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826677

  • Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, 10-12 April 2013. Osaka, Japan: Japan Institute of Electronics Packaging (JIEP).

  • Zeng, Guang, McDonald, Stuart, Gu, Qinfen and Nogita, Kazuhiro (2013). Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013.

  • Sweatman, K., Mcdonald, S. D., Whitewick, M., Nishimura, T. and Nogita, K. (2013). Grain refinement for improved lead-Free solder joint reliability. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, San Diego, United States, 19-21 February 2013. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries.

  • Mohd Salleh, M. A. A., McDonald, Stuart and Nogita, Kazuhiro (2013). Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review. ITMS 2013: 4th International Conference on Information Technology for Manufacturing Systems, Auckland, New Zealand, 27-29 August, 2013. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/AMM.421.260

  • Sweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. IPC APEX Expo 2012, San Diego, United States, 28 February - 1 March 2012. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries.

  • Palanisamy, S., Dargusch, M. S., McDonald, S. D. and St John, D. H. (2011). Machining of titanium alloys with and without coolant. 5th International Conference on Light Metals Technology, Lüneburg, Germany, 19-22 July 2011. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.690.481

  • Nogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew and McDonald, Stuart D. (2010). Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2851

  • Bermingham, Michael J., McDonald, Stuart D., Dargusch, Matthew S. and StJohn, David H. (2010). Effect of oxygen on the beta-grain size of cast titanium. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, 2-6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.1472

  • Palanisamy, Suresh, Cong, Luo, Verijenko, Viktor, McDonald, Stuart D., Owen, Robert and Dargusch, Matthew S. (2010). Tool failure criteria while drilling titanium alloys. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2531

  • Nogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP).

  • Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009.

  • Hideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging.

  • Nogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging.

  • Bermingham, Michael, McDonald, Stuart D., St John, David H. and Dargusch, Matthew S. (2009). Latest developments in understanding the grain refinement of cast titanium. 4th International Light Metals Technology Conference (LMT 2009), Gold Coast, Australia, 29 June - 1 July 2009. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.618-619.315

  • Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, 15-17 September 2009.

  • Nogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009.

  • Tsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS.

  • Nogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, 23-25 September 2008.

  • McDonald, Stuart, Dargusch, Matthew, Song, Guangling and StJohn, David (2007). Unintentional effects of Sr additions in Al-Si foundry alloys.

  • Dahle, A.K., Nogita, K. and McDonald, S.D. (2007). Engineering eutectic solidification in Al-Si Alloys. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Sheffield, United Kingdom: University of Sheffield.

  • Palanisamy, S., Dargusch, M. S., McDonald, S. D., Dowey, S. J. and Doyle, E. D. (2007). Machining of titanium alloys with and without coolant. 16th International Federation for Heat Treatment and Surface Engineering Congress, , , October 30, 2007-November 2, 2007. International Federation for Heat Treatment and Surface Engineering, IFHTSE.

  • Bermingham, M., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2007). Microstructure of cast titanium alloys. North Melbourne, VIC, Australia: Institute of Materials Engineering Australasia.

  • Nogita, K., McDonald, S.D. and Dahle, A.K. (2007). New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si Alloys. TMS Annual Meeting, Orlando, Florida, USA, February 25 - March 1 2007. United Stated: The Minerals, Metals and Materials Society.

  • Dargusch, M.S., McDonald, S.D., Palanisamy, S. and St John, D.H. (2007). The influence of Process Parameters during Machining of Ti6A14V Alloy. PRICM 6, Jeju Island, Korea, 5-9 November 2007. Switzerland: Trans Tech Publications.

  • Palanisamy, S., Dargusch, M. S., McDonald, S. D. and StJohn, D. H. (2007). The influence of process parameters during machining of Ti6Al4V alloy. PRICM 6: The Sixth Pacific Rim International Conference on Advanced materials and Processing, Cheju Island, South Korea, 5-9 November, 2007. Zurich, Switzerland: Trans Tech Publications INC.. doi: 10.4028/www.scientific.net/MSF.561-565.159

  • McDonald, S.D., Dargusch, M.S., Song, G. and St John, D.H. (2007). Unintentional Effects of Sr Additions in Al-Si Foundry Alloys. TMS Annual Meeting and Exhibition, Orlando, Florida, USA, 25 February to 1 March, 2007. United Stated: TMS (The Minerals, Metals and Materials Society).

  • Palanisamy, S., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2007). Vibration and surface deformation during machining of Ti6Al4V alloys. Light Metals Technology Conference 2007, Canada, 24-26 September, 2007. Canada: Public Works and Government Services Canada.

  • McDonald, S. D., Lu, L., Nogita, K. and Dahle, A. K. (2005). The role of the eutectic in porosity formation in Al-Si foundry alloys. Shape Casting - The John Campbell Symposium - TMS 2005 Annual Meeting, San Francisco, California, 13-17 February 2005 .

  • Nogita, K., McDonald, S. D., Tsujimoto, K., Yasuda, K. and Dahle, A. K. (2004). Finding eutectic nuclei in hypoeutectic Al-Si alloys by focused ion beam milling. Proceedings of Japan Institute of Metals Fall Meeting, Japan, 28-30 September 2004. Japan: Japan Institute of Metals.

  • Nogita, K., McDonald, S. D., Dinnis, C. M., Lu, L. and Dahle, A. K. (2004). Recent progress in understanding eutectic solidification in aluminium-silicon foundry alloys. 2004 TMS Annual Meeting and Exhibition, Charlotte, North Carolina, U.S.A., 14-18 March 2004. Warrendale, PA, U.S.A.: The Minerals, Metals and Materials Society.

  • Nogita, K., McDonald, S. and Dahle, A. K. (2003). Eutectic modification of hypoeutectic Al-Si alloys with rare earth metals. Proceedings of Japan Institute of Metals Fall Meeting, Japan, 11-13 October 2003. Japan: Japan Institute of Metals.

  • Nogita, K., McDonald, S. D. and Dahle, A. K. (2002). Effects of boron on eutectic modification of hypoeutectic Al-Si alloys. 2002 Japan Institute of Metals Fall Meeting, Osaka University, Osaka, Japan, 2-4 November, 2002. Sendai, Japan: Japan Institute of Metals.

  • Dahle, A. K., McDonald, S. D. and Nogita, K. (2002). Eutectic solidification in hypoeutectic Al-Si alloys and its effect on porosity. The 17th International Conference of Australian Society for Ey, Materials Solutions 2002, Columbus, OH, USA, 7-9 October 2002. Materials Park, OH 44073-0002, USA: ASM International, Member/Customer Service Center.

  • McDonald, S., Dahle, A. K., Taylor, J. A. and St John, D. H. (2001). Eutectic solidification in Sr-modified hypoeutectic Al-Si alloys. Biennial Conference of Institute of Materials Engineering Australia, Melbourne, Vic, 23-26 Sept 2001. Melbourne: Institute of Materials Engineering Australia.

  • Dahle, A. K., Nogita, K., McDonald, S. and Zindel, J. W. (2001). Understanding eutectic formation in hypoeutectic Al-Si alloys. TMS 130th Annual Int. Meeting & Exhibition, New Orleans, USA, 11-15 Feb 2001. USA: TMS.

  • Otte, M., McDonald, S., Taylor, J. A., St John, D. H. and Schneider, W. E. (2000). Controlling porosity-related casting rejects: Understanding the role of iron in Al-Si alloys. 103rd AFS Casting Congress, St Louis, MO, USA, 13-16 March 1999. Des Plaines, Illinois, USA: American Foundrymen's Society.

  • McDonald, S., Nogita, K., Dahle, A. K., Taylor, J. A. and St John, D. H. (2000). Eutectic solidification and porosity formation in Al-Si alloys: the role of strontium. 104th AFS Casting Congress, Pittsburgh, PA, USA, 8-11 April 2000. Des Plaines, Illinois, USA: American Foundrymen's Society.

  • McDonald, S. D., Dahle, A. K., Taylor, J. A., St John, D. H. and Zindel, J. W. (2000). Microstructural evolution of an Al-Si-Mg foundry alloy during solidification. Die Casting 2000, Melbourne, Australia, 3 - 6 September, 2000. Melbourne: Australian Die Casting Assocation (ADCA).

Other Outputs

Grants (Administered at UQ)

PhD and MPhil Supervision

Current Supervision

Completed Supervision