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Intermetallic compounds for high reliability electronic interconnections (2020–2023)

Abstract:
The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.
Grant type:
ARC Discovery Projects
Researchers:

  • Professor Kazuhiro Nogita

    Professor
    School of Mechanical and Mining Engineering
    Faculty of Engineering, Architecture and Information Technology

  • Dr Michael Bermingham

    Senior Research Fellow
    School of Mechanical and Mining Engineering
    Faculty of Engineering, Architecture and Information Technology
Funded by:
Australian Research Council