The University of Queensland

In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974

Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys

Hao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8

In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography

Hao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383

The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2023). The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1

Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows

Chang, M.S., Mohd Salleh, M.A.A., Halin, D.S.C., Somidin, F., Yasuda, H. and Nogita, K. (2023). Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows. Journal of Materials Research and Technology, 26, 8670-8687. doi: 10.1016/j.jmrt.2023.09.139

The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint

Chang, M.S., Mohd Salleh, M.A.A., Somidin, F., Halin, D.S.C., Yasuda, H. and Nogita, K. (2023). The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint. Materials Science and Engineering A: Structural Materials: Properties, Microstructures and Processing, 882 145457, 145457. doi: 10.1016/j.msea.2023.145457

Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides

Tan, Xin F., Kim, Manjin, Yasuda, Kazuhiro and Nogita, Kazuhiro (2023). Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides. Journal of Materials Science and Technology, 153, 139-158. doi: 10.1016/j.jmst.2022.12.054

Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys

Yao, Hu, Zeng, Guang, Tan, Xin F., Gu, Qinfen, Nogita, Kazuhiro, Guo, Jing and Li, Qian (2023). Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys. Journal of Materials Science and Technology, 151, 162-177. doi: 10.1016/j.jmst.2022.12.015

The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934

Effects of multiple reflow on the formation of primary crystals in Sn-3.5Ag and solder joint strength: experimental and finite element analysis

Amli, Siti Farahnabilah Muhd, Salleh, Mohd Arif Anuar Mohd, Aziz, Mohd Sharizal Abdul, Yasuda, Hideyuki, Nogita, Kazuhiro, Abdullah, Mohd Mustafa Al Bakri, Nemes, Ovidiu, Sandu, Andrei Victor and Vizureanu, Petrica (2023). Effects of multiple reflow on the formation of primary crystals in Sn-3.5Ag and solder joint strength: experimental and finite element analysis. Materials, 16 (12) 4360, 1-17. doi: 10.3390/ma16124360

The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys

Zhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y

Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath

Qu, Dongdong, Gear, Matthew, Gu, Qinfen, Setargew, Nega, Renshaw, Wayne, McDonald, Stuart, StJohn, David and Nogita, Kazuhiro (2023). Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath. Materials, 16 (3) 1211. doi: 10.3390/ma16031211

Events That Led Me to Establish the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) at the University of Queensland, Australia オーストラリア Queensland 大学で，日本スペリア電子材料製造研究センター (NS CMEM) を設立してみた。

Nogita, Kazuhiro (2023). Events That Led Me to Establish the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) at the University of Queensland, Australia オーストラリア Queensland 大学で，日本スペリア電子材料製造研究センター (NS CMEM) を設立してみた。. Journal of Japan Institute of Electronics Packaging, 26 (6), 571-576. doi: 10.5104/jiep.26.571

Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints

Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints. Materials, 15 (23) 8321, 1-12. doi: 10.3390/ma15238321

Grain refinement of primary Cu6Sn5 in the Sn-3wt%Ag-5wt%Cu alloy by Ge

Tan, C.Y., Salleh, M.A.A.Mohd, Saud, N., Chaiprapa, J. and Nogita, K. (2022). Grain refinement of primary Cu6Sn5 in the Sn-3wt%Ag-5wt%Cu alloy by Ge. Journal of Materials Research and Technology, 21, 3301-3312. doi: 10.1016/j.jmrt.2022.10.128

Negative thermal expansion and phase transition of low-temperature Mg2NiH4

Luo, Qun, Cai, Qi, Gu, Qinfen, Shi, Yu, Liu, Bin, Tran, Xuan Quy, Matsumura, Syo, Zhang, Tong-Yi, Nogita, Kazuhiro, Lyu, Tao, Li, Qian and Pan, Fusheng (2022). Negative thermal expansion and phase transition of low-temperature Mg2NiH4. Journal of Magnesium and Alloys, 11 (9), 3338-3349. doi: 10.1016/j.jma.2022.09.012

Understanding micro and atomic structures of secondary phases in Cu‐doped SnTe

Kawami, Youichirou, Tran, Xuan Quy, Aso, Kohei, Yamamoto, Tomokazu, Wang, Yuan, Li, Meng, Yago, Anya, Matsumura, Syo, Nogita, Kazuhiro and Zou, Jin (2022). Understanding micro and atomic structures of secondary phases in Cu‐doped SnTe. Small, 18 (42) 2204225, 1-12. doi: 10.1002/smll.202204225

Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage

Tan, Xin F., Kim, Manjin, Gu, Qinfen, Pinzon Piraquive, Julio, Zeng, Guang, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage. Journal of Power Sources, 538 231538, 231538. doi: 10.1016/j.jpowsour.2022.231538

Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint

Abdul Razak, N. R., Tan, X. F., Mohd Salleh, M. A. A., McDonald, S. D., Bermingham, M. J., Yasuda, H. and Nogita, K. (2022). Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint. Materials Today Communications, 31 103248, 103248. doi: 10.1016/j.mtcomm.2022.103248

Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg

Tan, C. Y., Salleh, M.A.A. Mohd, Tan, X. F., Yasuda, H., Saud, N., Ramli, M. I.I. and Nogita, K. (2022). Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg. Materials Today Communications, 31 103221, 103221. doi: 10.1016/j.mtcomm.2022.103221

Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder

Amli, S. F. Muhd, Salleh, M. A. A. Mohd, Ramli, M. I. I., Aziz, M. S. Abdul, Yasuda, H., Chaiprapa, J. and Nogita, K. (2022). Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder. Journal of Materials Science: Materials in Electronics, 33 (17), 14249-14263. doi: 10.1007/s10854-022-08353-z

Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical properties

Tan, Xin F., Tao, Shiwei, Ran, Lingbing, Knibbe, Ruth and Nogita, Kazuhiro (2022). Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical properties. Nano Select, 3 (8), 1264-1276. doi: 10.1002/nano.202200056

Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process

Kim, Manjin, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D., Ali, Yahia, Matsumura, Syo and Nogita, Kazuhiro (2022). Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process. International Journal of Hydrogen Energy, 47 (36), 16132-16143. doi: 10.1016/j.ijhydene.2022.03.102

Effect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0Ag-0.5Cu solder joints during multiple reflow

Zaimi, Nur Syahirah Mohamad, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al-Bakri, Nadzri, Nur Izzati Muhammad, Sandu, Andrei Victor, Vizureanu, Petrica, Ramli, Mohd Izrul Izwan, Nogita, Kazuhiro, Yasuda, Hideyuki and Sandu, Ioan Gabriel (2022). Effect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0Ag-0.5Cu solder joints during multiple reflow. Materials, 15 (8) 2758. doi: 10.3390/ma15082758

The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy

Chang, M. S., Salleh, M. A. A. Mohd, Halin, D. S. C., Ramli, M. I. I., Yasuda, H. and Nogita, K. (2022). The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy. Journal of Alloys and Compounds, 897 163172, 1-10. doi: 10.1016/j.jallcom.2021.163172

Liquid/solid interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu dissimilar joints during soldering at low temperature by in-situ synchrotron imaging

Ramli, M. I.I., Salleh, M. A. A. Mohd, Nishimura, T., Yasuda, H., Zaimi, N. S. Mohamad and Nogita, K. (2022). Liquid/solid interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu dissimilar joints during soldering at low temperature by in-situ synchrotron imaging. JOM, 74 (7), 2760-2769. doi: 10.1007/s11837-022-05229-9

Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering

Tan, Xin F., Gu, Qinfen, Bermingham, Michael, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering. Acta Materialia, 226 117661. doi: 10.1016/j.actamat.2022.117661

The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys

Hao, Qichao, Tan, Xin F., Gu, Qinfen, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74 (4), 1739-1750. doi: 10.1007/s11837-021-05145-4

Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5

Yang, Wenhui, Tran, Xuan Quy, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Tan, Xin Fu, Kawami, Youichirou, Nogita, Kazuhiro and Matsumura, Syo (2022). Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5. Acta Materialia, 224 117513, 117513. doi: 10.1016/j.actamat.2021.117513

In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy

Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Bermingham, Michael J., Maeno, Hiroshi, Matsumura, Syo and Nogita, Kazuhiro (2022). In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy. Materials, 15 (2) 510, 510. doi: 10.3390/ma15020510

Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review

Zeng, Guang, Liu, Shiqian, Gu, Qinfen, Zheng, Zebang, Yasuda, Hideyuki, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review. Acta Metallurgica Sinica, 35 (1), 49-66. doi: 10.1007/s40195-021-01350-x

Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime

Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime. Acta Materialia, 220 117295, 1-11. doi: 10.1016/j.actamat.2021.117295

Re-evaluation of the mechanical properties and creep resistance of commercial magnesium die-casting alloy AE44

Zhu, Suming, Abbott, Trevor B., Nie, Jian-Feng, Ang, Hua Qian, Qiu, Dong, Nogita, Kazuhiro and Easton, Mark A. (2021). Re-evaluation of the mechanical properties and creep resistance of commercial magnesium die-casting alloy AE44. Journal of Magnesium and Alloys, 9 (5), 1537-1545. doi: 10.1016/j.jma.2021.04.016

Rapid fabrication of tin-copper anodes for lithium-ion battery applications

Tan, Xin Fu, Belyakov, Sergey A., Su, Te-Cheng, Gu, Qinfen, Liu, Shiqian, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Hideyuki, Matsumura, Syo and Nogita, Kazuhiro (2021). Rapid fabrication of tin-copper anodes for lithium-ion battery applications. Journal of Alloys and Compounds, 867 159031, 159031. doi: 10.1016/j.jallcom.2021.159031

Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints

Liu, Shiqian, Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2021). Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints. Intermetallics, 133 107168, 1-9. doi: 10.1016/j.intermet.2021.107168

The effect of Na addition on the first hydrogen absorption kinetics of cast hypoeutectic Mg–La alloys

Kim, Manjin, Gu, Qinfen, Hussain, Tanveer, Ali, Yahia, Abbott, Trevor B. and Nogita, Kazuhiro (2021). The effect of Na addition on the first hydrogen absorption kinetics of cast hypoeutectic Mg–La alloys. International Journal of Hydrogen Energy, 46 (53), 27096-27106. doi: 10.1016/j.ijhydene.2021.05.180

In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography

Abdul Razak, N.R., Tan, X.F., Somidin, F., Yasuda, H., McDonald, S.D. and Nogita, K. (2021). In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography. Materials Letters, 291 129520, 1-4. doi: 10.1016/j.matlet.2021.129520

Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG)

Teoh, A.L., Mohd Salleh, M.A.A., Halin, D.S.C., Foo, K.L., Abdul Razak, N.R., Yasuda, H. and Nogita, K. (2021). Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG). Journal of Materials Research and Technology, 12, 1700-1714. doi: 10.1016/j.jmrt.2021.03.068

Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu Alloys

Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu Alloys. Journal of Electronic Materials, 50 (3), 881-892. doi: 10.1007/s11664-020-08709-3

Microstructure evolution of Ag/TiO2 thin film

Halin, Dewi Suriyani Che, Razak, Kamrosni Abdul, Mohd Salleh, Mohd Arif Anuar, Ramli, Mohd Izrul Izwan, Abdullah, Mohd Mustafa Al Bakri, Azhari, Ayu Wazira, Nogita, Kazuhiro, Yasuda, Hideyuki, Nabiałek, Marcin and Wysłocki, Jerzy J. (2021). Microstructure evolution of Ag/TiO2 thin film. Magnetochemistry, 7 (1) 14, 1-10. doi: 10.3390/magnetochemistry7010014

Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength

Muhd Amli, S. F. N., Mohd Salleh, M. A. A., Ramli, M. I. I., Abdul Razak, N. R., Yasuda, H., Chaiprapa, J. and Nogita, K. (2021). Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength. Journal of Electronic Materials, 50 (3), 855-868. doi: 10.1007/s11664-020-08641-6

A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system

Kim, Manjin, McDonald, Stuart D., Abbott, Trevor B., Easton, Mark A., Ali, Yahia, StJohn, David H. and Nogita, Kazuhiro (2020). A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system. Journal of Alloys and Compounds, 844 156068, 156068. doi: 10.1016/j.jallcom.2020.156068

Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications

Tan, Xin F., Gu, Qinfen, Qu, Dongdong, Yong, Adrian X.B., Yang, Wenhui, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2020). Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications. Acta Materialia, 201, 341-349. doi: 10.1016/j.actamat.2020.10.011

Origin of primary Cu6Sn5 in hypoeutectic solder alloys and a method of suppression to improve mechanical properties

Muhd Amli, S. F.N., Mohd Salleh, M. A.A., Ramli, M. I.I., Yasuda, H., Chaiprapa, J., Somidin, F., Shayfull, Z. and Nogita, K. (2020). Origin of primary Cu6Sn5 in hypoeutectic solder alloys and a method of suppression to improve mechanical properties. Journal of Electronic Materials, 50 (3), 710-722. doi: 10.1007/s11664-020-08428-9

Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storage

Kim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor and Nogita, Kazuhiro (2020). Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storage. Journal of Nanoscience and Nanotechnology, 20 (8), 5192-5200. doi: 10.1166/jnn.2020.18529

The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodes

Tan, Xin Fu, Yong, Adrian Xiao Bin, Gu, Qinfen, Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2020). The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodes. Journal of Nanoscience and Nanotechnology, 20 (8), 5182-5191. doi: 10.1166/jnn.2020.18538

Atomic locations of minor dopants and their roles in the stabilization of η−Cu6Sn5

Yang, Wenhui, Quy Tran, Xuan, Yamamoto, Tomokazu, Yoshioka, Satoru, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2020). Atomic locations of minor dopants and their roles in the stabilization of η−Cu6Sn5. Physical Review Materials, 4 (6) 065002. doi: 10.1103/physrevmaterials.4.065002

Intermetallic formation mechanisms and properties in room-temperature Ga soldering

Liu, Shiqian, Qu, Dongdong, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Intermetallic formation mechanisms and properties in room-temperature Ga soldering. Journal of Alloys and Compounds, 826 154221, 154221. doi: 10.1016/j.jallcom.2020.154221

On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrate

Qu, D.D., Gear, M., Setargew, N., Renshaw, W., McDonald, S., StJohn, D., Paterson, D.J. and Nogita, K. (2020). On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrate. Materialia, 11 100669, 100669. doi: 10.1016/j.mtla.2020.100669

Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste

Mohd Said, R., Mohd Salleh, M. A. A., Saud, N., Ramli, M. I. I., Yasuda, H. and Nogita, K. (2020). Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste. Journal of Materials Science: Materials in Electronics, 31 (14), 11077-11094. doi: 10.1007/s10854-020-03657-4

Interfacial reactions between Ga and Cu-10Ni substrate at low temperature

Liu, Shiqian, Zeng, Guang, Yang, Wenhui, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Interfacial reactions between Ga and Cu-10Ni substrate at low temperature. ACS Applied Materials and Interfaces, 12 (18) acsami.0c02032, 21045-21056. doi: 10.1021/acsami.0c02032

Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile

Somidin, Flora, McDonald, Stuart David, Ye, Xiaozhou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile. Japan Institute of Electronics Packaging. Transactions, 13, E19-004. doi: 10.5104/jiepeng.13.e19-004-1

Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds

Somidin, Flora, Maeno, Hiroshi, Toriyama, Takaaki, McDonald, Stuart D., Yang, Wenhui, Matsumura, Syo and Nogita, Kazuhiro (2020). Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds. Materialia, 9 100530, 100530. doi: 10.1016/j.mtla.2019.100530

The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

Ramli, M. I.I., Mohd Salleh, M. A.A., Yasuda, H., Chaiprapa, J. and Nogita, K. (2020). The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering. Materials and Design, 186 108281, 108281. doi: 10.1016/j.matdes.2019.108281

Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature

Liu, Shiqian, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, Sweatman, Keith, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature. Journal of Electronic Materials, 49 (1), 128-139. doi: 10.1007/s11664-019-07688-4

The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatings

Ramli, M. I.I., Mohd Salleh, M. A.A., Abdullah, M. M.A., Narayanan, P., Chaiprapa, J., Mohd Said, R., Yoriya, S. and Nogita, K. (2020). The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatings. Journal of Electronic Materials, 49 (1), 1-12. doi: 10.1007/s11664-019-07596-7

Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes

Tan, Xin F., Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes. ACS Applied Energy Materials, 3 (1) acsaem.9b02014, 141-145. doi: 10.1021/acsaem.9b02014

The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes

Tan, Xin F., McDonald, Stuart D., Gu, Qinfen, Wang, Lianzhou, Matsumura, Syo and Nogita, Kazuhiro (2019). The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes. Journal of Power Sources, 440 227085, 227085. doi: 10.1016/j.jpowsour.2019.227085

Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction

Liu, Shiqian, Yang, Wenhui, Kawami, Youichirou, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, McDonald, Stuart and Nogita, Kazuhiro (2019). Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction. ACS Applied Materials and Interfaces, 11 (35) acsami.9b10630, 32523-32532. doi: 10.1021/acsami.9b10630

In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy

Zeng, G., Callaghan, M. D., McDonald, S. D., Yasuda, H. and Nogita, K. (2019). In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy. Journal of Alloys and Compounds, 797, 804-810. doi: 10.1016/j.jallcom.2019.04.153

Solidification path and microstructure evolution of Mg-3Al-14La alloy: implications for the Mg-rich corner of the Mg-Al-La phase diagram

Wong, Charlotte, Nogita, Kazuhiro, Styles, Mark J., Zhu, Suming, Qiu, Dong, McDonald, Stuart D., Gibson, Mark A., Abbott, Trevor B. and Easton, Mark A. (2019). Solidification path and microstructure evolution of Mg-3Al-14La alloy: implications for the Mg-rich corner of the Mg-Al-La phase diagram. Journal of Alloys and Compounds, 784, 527-534. doi: 10.1016/j.jallcom.2019.01.029

Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector

Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Hu, Yuxiang, Wang, Lianzhou, Matsumura, Syo, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector. Journal of Power Sources, 415, 50-61. doi: 10.1016/j.jpowsour.2019.01.034

Experimental determination of the Sn-Cu-Ni phase diagram for Pb-free solder applications

Henao, Hector M., Chu, Ching-shun, Solis, Juan P. and Nogita, Kazuhiro (2019). Experimental determination of the Sn-Cu-Ni phase diagram for Pb-free solder applications. Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science, 50 (1), 502-516. doi: 10.1007/s11663-018-1456-8

Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during soldering

Ramli, M.I.I., Mohd Salleh, M.A.A., Mohd Sobri, F. A., Narayanan, P., Sweatman, K. and Nogita, K. (2019). Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during soldering. Journal of Materials Science: Materials in Electronics, 30 (4), 3669-3677. doi: 10.1007/s10854-018-00647-5

Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloys

Peng, L., Zeng, G., Su, T. C., Yasuda, H., Nogita, K. and Gourlay, C. M. (2019). Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloys. JOM, 71 (7), 2235-2244. doi: 10.1007/s11837-019-03471-2

Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound

Yang, Wenhui, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2019). Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound. Scripta Materialia, 158, 1-5. doi: 10.1016/j.scriptamat.2018.08.020

Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint

Somidin, Flora, Maeno, Hiroshi, Tran, Xuan, McDonald, Stuart D., Mohd Salleh, Mohd, Matsumura, Syo and Nogita, Kazuhiro (2018). Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. Materials, 11 (11) 2229, 2229. doi: 10.3390/ma11112229

Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni

Xian, J. W., Mohd Salleh, M. A.A., Belyakov, S. A., Su, T. C., Zeng, G., Nogita, K., Yasuda, H. and Gourlay, C. M. (2018). Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni. Intermetallics, 102, 34-45. doi: 10.1016/j.intermet.2018.08.002

Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni

Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart, Yasuda, Hideyuki and St John, David (2018). Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni. Journal of Alloys and Compounds, 766, 1003-1013. doi: 10.1016/j.jallcom.2018.06.251

Ga-based alloys in microelectronic interconnects: a review

Liu, Shiqian, Sweatman, Keith, McDonald, Stuart and Nogita, Kazuhiro (2018). Ga-based alloys in microelectronic interconnects: a review. Materials, 11 (8) 1384. doi: 10.3390/ma11081384

The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: review

Liu, Shiqian, McDonald, Stuart, Sweatman, Keith and Nogita, Kazuhiro (2018). The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: review. Microelectronics Reliability, 84, 170-180. doi: 10.1016/j.microrel.2018.03.038

Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain

Somidin, Flora, Maeno, Hiroshi, Mohd Salleh, M. A.A., Tran, Xuan Quy, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2018). Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain. Materials Characterization, 138, 113-119. doi: 10.1016/j.matchar.2018.02.006

Preface

Nogita, Kazuhiro, Mohd Salleh, Mohd Arif Anuar, Abdullah, Mohd Mustafa Al Bakri, Jamaludin, Liyana and Mohd Tahir, Muhammad Faheem (2018). Preface. Solid State Phenomena, 273 SSP

Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and beta Sn

Xian, J. W., Zeng, G., Belyakov, S. A., Gu, Q., Nogita, K. and Gourlay, C. M. (2017). Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and beta Sn. Intermetallics, 91, 50-64. doi: 10.1016/j.intermet.2017.08.002

Reply to 'Comments on "evidence of the hydrogen release mechanism in bulk MgH2"'

Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2017). Reply to 'Comments on "evidence of the hydrogen release mechanism in bulk MgH2"'. Scientific Reports, 7 (1) 43720, 1-3. doi: 10.1038/srep43720

Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

Mohd Salleh, M. A. A., McDonald, S. D. and Nogita, K. (2017). Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates. Journal of Materials Processing Technology, 242, 235-245. doi: 10.1016/j.jmatprotec.2016.11.031

Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections

Xian, J. W., Belyakov, S. A., Ollivier, M., Nogita, K., Yasuda, H. and Gourlay, C. M. (2017). Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections. Acta Materialia, 126, 540-551. doi: 10.1016/j.actamat.2016.12.043

In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Yamamoto, Tomokazu, Shigematsu, Koji, Aso, Kohei, Tanaka, Eishi, Matsumura, Syo and Nogita, Kazuhiro (2017). In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4. Journal of Power Sources, 341, 130-138. doi: 10.1016/j.jpowsour.2016.11.105

In situ imaging of microstructure formation in electronic interconnections

Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D. and Nogita, K. (2017). In situ imaging of microstructure formation in electronic interconnections. Scientific Reports, 7 (1) 40010, 40010. doi: 10.1038/srep40010

Time-resolved and in-situ observation of solidification phenomena

Yasuda, Hideyuki, Nagira, Tomoya, Yoshiya, Masato, Morishita, Kohei and Nogita, Kazuhiro (2017). Time-resolved and in-situ observation of solidification phenomena. Journal of the Japan Welding Society, 86 (5), 362-363.

The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, Salleh, M. A. A. Mohd and Nogita, Kazuhiro (2016). The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints. Journal of Alloys and Compounds, 685, 471-482. doi: 10.1016/j.jallcom.2016.05.263

In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates

Nogita, K., Mohd Salleh, M. A. A., Tanaka, E., Zeng, G., McDonald, S. D. and Matsumura, S. (2016). In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates. JOM, 68 (11), 2871-2878. doi: 10.1007/s11837-016-2020-0

Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys

Tran, Xuan Quy, McDonald, Stuart D. , Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (10), 6851-6861. doi: 10.1016/j.ijhydene.2016.12.007

Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles

Salleh, M. A. A. Mohd, McDonald, S. D., Gourlay, C. M., Yasuda, H. and Nogita, K. (2016). Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles. Materials and Design, 108, 418-428. doi: 10.1016/j.matdes.2016.06.121

Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (1), 366-375. doi: 10.1016/j.ijhydene.2016.08.110

Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering

Mohd Salleh, M. A A, Said, R. M., Saud, N., Yasuda, H., McDonald, S. D. and Nogita, K. (2016). Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering. Key Engineering Materials, 700, 161-169. doi: 10.4028/www.scientific.net/KEM.700.161

Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni. Journal of Materials Research, 31 (9), 1316-1327. doi: 10.1557/jmr.2016.123

Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review

Mu, D.K., McDonald, S.D., Read, J., Huang, H. and Nogita, K. (2016). Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review. Current Opinion in Solid State and Materials Science, 20 (2), 55-76. doi: 10.1016/j.cossms.2015.08.001

Understanding the Origin of Li2MnO3 Activation in Li-Rich Cathode Materials for Lithium-Ion Batteries

Ye, Delai, Zeng, Guang, Nogita, Kazuhiro, Ozawa, Kiyoshi, Hankel, Marlies, Searles, Debra J and Wang, Lianzhou (2015). Understanding the Origin of Li2MnO3 Activation in Li-Rich Cathode Materials for Lithium-Ion Batteries. Advanced Functional Materials, 25 (48), 7488-7496. doi: 10.1002/adfm.201503276

A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys

Prasad, Arvind, Macdonald, Stuart D., Yasuda, Hideyuki, Nogita, Kazuhiro and StJohn, David (2015). A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys. Journal of Crystal Growth, 430, 122-137. doi: 10.1016/j.jcrysgro.2015.06.024

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H. and Nogita, K. (2015). Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process. Journal of Electronic Materials, 45 (1), 154-163. doi: 10.1007/s11664-015-4121-x

Kinetics of the β → α transformation of tin: role of α-tin nucleation

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2015). Kinetics of the β → α transformation of tin: role of α-tin nucleation. Crystal Growth and Design, 15 (12), 5767-5773. doi: 10.1021/acs.cgd.5b01069

Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy

Salleh, M. A. A. Mohd, McDonald, S. D., Terada, Y., Yasuda, H. and Nogita, K. (2015). Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy. Materials & Design, 82, 136-147. doi: 10.1016/j.matdes.2015.05.077

In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy

Tran, X. Q., McDonald, S. D., Gu, Q. F. and Nogita, K. (2015). In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy. Journal of Alloys and Compounds, 636 33418, 249-256. doi: 10.1016/j.jallcom.2015.02.044

Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

Mohd Salleh, M. A. A., McDonald, S. D., Yasuda, H., Sugiyama, A. and Nogita, K. (2015). Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces. Scripta Materialia, 100, 17-20. doi: 10.1016/j.scriptamat.2014.11.039

Metallic tin recovery from wave solder dross

Henao, Hector M, Masuda, Chisato and Nogita, Kazuhiro (2015). Metallic tin recovery from wave solder dross. International Journal of Mineral Processing, 137, 98-105. doi: 10.1016/j.minpro.2015.02.006

In-situ soldering process technique by synchrotron X-ray imaging

Mohd Salleh, M. A. A., Sugiyama, A., Yasuda, H., McDonald, S. D. and Nogita, Naz (2015). In-situ soldering process technique by synchrotron X-ray imaging. Applied Mechanics and Materials, 754-755, 508-512. doi: 10.4028/www.scientific.net/AMM.754-755.508

Electrochemical and structural study of layered P2-type Na2/3Ni1/3Mn2/3O2 as cathode material for sodium-ion battery

Wen, Yanfen, Wang, Bei, Zeng, Guang, Nogita, Kazuhiro, Ye, Delai and Wang, Lianzhou (2015). Electrochemical and structural study of layered P2-type Na2/3Ni1/3Mn2/3O2 as cathode material for sodium-ion battery. Chemistry - An Asian Journal, 10 (3), 661-666. doi: 10.1002/asia.201403134

Evidence of the hydrogen release mechanism in bulk MgH2

Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2015). Evidence of the hydrogen release mechanism in bulk MgH2. Scientific Reports, 5 (8450) 43720, 1-5. doi: 10.1038/srep08450

The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Terada, Yasuko, Uesugi, Kentaro, Yasuda, Hideyuki and Nogita, Kazuhiro (2015). The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints. Acta Materialia, 83, 357-371. doi: 10.1016/j.actamat.2014.10.003

Comparison of solidification behavior between in situ observation and simulation of Fe-C-Si system

Henao, Hector M., Sugiyama, Akira and Nogita, Kazuhiro (2014). Comparison of solidification behavior between in situ observation and simulation of Fe-C-Si system. Journal of Alloys and Compounds, 613, 132-138. doi: 10.1016/j.jallcom.2014.05.184

Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen and Nogita, Kazuhiro (2014). Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 20-27. doi: 10.1016/j.intermet.2014.05.004

Kinetics of the polymorphic phase transformation of Cu6Sn5

Zeng, Guang, McDonald, Stuart David, Read, Jonathan J., Gu, Qinfen and Nogita, Kazuhiro (2014). Kinetics of the polymorphic phase transformation of Cu6Sn5. Acta Materialia, 69, 135-148. doi: 10.1016/j.actamat.2014.01.027

Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation

Zeng, Guang, McDonald, Stuart David, Gourlay, Christopher M., Uesugi, Kentaro, Terada, Yasuko, Yasuda, Hideyuki and Nogita, Kazuhiro (2014). Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation. Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science, 45 (2), 918-926. doi: 10.1007/s11661-013-2008-0

Effects of element addition on the beta->alpha transformation in tin

Zeng, Guang, McDonald, Stuart David, Gu, Qinfen, Sweatman, Keith and Nogita, Kazuhiro (2014). Effects of element addition on the beta->alpha transformation in tin. Philosophical Magazine Letters, 94 (2), 53-62. doi: 10.1080/09500839.2013.860247

Grain refinement for improved lead-free solder joint reliability

Sweatman, K., Nishimura, T., McDonald, S. D., Whitewick, M. and Nogita, K. (2014). Grain refinement for improved lead-free solder joint reliability. SMT Surface Mount Technology Magazine, 29 (1), 30-41.

Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Suenaga, Shoichi, Zhang, Yong, Chen, Jianghua and Nogita, Kazuhiro (2013). Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In. Intermetallics, 43, 85-98. doi: 10.1016/j.intermet.2013.07.012

Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloys

Nogita, Kazuhiro, Yasuda, Hideyuki, Prasad, Arvind, McDonald, Stuart D., Nagira, Tomoya, Nakatsuka, Noriaki, Uesugi, Kentaro and StJohn, David H. (2013). Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloys. Materials Characterization, 85, 134-140. doi: 10.1016/j.matchar.2013.08.015

XRD study of the kinetics of transformations in tin

Nogita, K., Gourlay, C. M., McDonald, S. D., Suenaga, S., Read, J., Zeng, G. and Gu, Q. F. (2013). XRD study of the kinetics of transformations in tin. Philosophical Magazine, 93 (27), 3627-3647. doi: 10.1080/14786435.2013.820381

A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods

Salleh, Mohd Arif Anuar Mohd, Al Bakri, Abdullah Mohd Mustafa, Somidin, Flora, Sandu, Andrei Victor, Saud, Norainiza, Kamaruddin, Hussin, McDonald, Stuart D. and Nogita, Kazuhiro (2013). A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods. Revista De Chimie, 64 (7), 725-728.

Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5

Wu, Y. Q., McDonald, S. D., Read, J., Huang, H. and Nogita, K. (2013). Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5. Scripta Materialia, 68 (8), 595-598. doi: 10.1016/j.scriptamat.2012.12.012

Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes

Mu, D., Huang, H., McDonald, S. D., Read, J. and Nogita, K. (2013). Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 566, 126-133. doi: 10.1016/j.msea.2012.12.057

Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures

Mu, Dekui, Huang, Han, McDonald, Stuart D. and Nogita, Kazuhiro (2013). Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures. Journal of Electronic Materials, 42 (2), 304-311. doi: 10.1007/s11664-012-2227-y

Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys

McDonald, Stuart, Nogita, Kazuhiro, Read, Jonathan, Ventura, Tina and Nishimura, Tetsuro (2013). Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys. Journal of Electronic Materials, 42 (2), 256-262. doi: 10.1007/s11664-012-2222-3

Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, C02, N2 and H2

Nogita, K., McDonald, S., Duguid, A., Tsubota, M. and Gu, Q. F. (2013). Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, C02, N2 and H2. Journal of Alloys and Compounds, 580 (SUPPL1), S140-S143. doi: 10.1016/j.jallcom.2013.01.006

Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloys

Nogita, Kazuhiro, Yasuda, Hideyuki, McDonald, Stuart D. and Uesugi, Kentaro (2013). Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloys. Advanced Materials Research, 626, 200-204. doi: 10.4028/www.scientific.net/AMR.626.200

A new phase in stoichiometric Cu6Sn5

Wu, Y. Q., Barry, J., Yamamoto, T., Gu, Q. F., McDonald, S. D., Matsumura, S., Huang, H. and Nogita, K. (2012). A new phase in stoichiometric Cu6Sn5. Acta Materialia, 60 (19), 6581-6591. doi: 10.1016/j.actamat.2012.08.024

Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5

Mu, D., Huang, H. and Nogita, K. (2012). Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86, 46-49. doi: 10.1016/j.matlet.2012.07.018

Effect of cooling rate on the intermetallic layer in solder joints

Sweatman, K., Nishimura, T., McDonald, S. and Nogita, K. (2012). Effect of cooling rate on the intermetallic layer in solder joints. SMT Surface Mount Technology Magazine, 27 (11), 68-77.

Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen and Nogita, Kazuhiro (2012). Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics. Journal of Materials Research, 27 (20), 2609-2614. doi: 10.1557/jmr.2012.247

Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu

Mu, Dekui, Yasuda, Hideyuki, Huang, Han and Nogita, Kazuhiro (2012). Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 38-46. doi: 10.1016/j.jallcom.2012.04.110

Development of high-temperature solders: Review

Zeng, Guang, McDonald, Stuart and Nogita, Kazuhiro (2012). Development of high-temperature solders: Review. Microelectronics Reliability, 52 (7), 1306-1322. doi: 10.1016/j.microrel.2012.02.018

Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2)

Nogita, K., Mu, D., McDonald, S. D., Read, J. and Wu, Y. Q. (2012). Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2). Intermetallics, 26, 78-85. doi: 10.1016/j.intermet.2012.03.047

Kinetics of the eta-eta' transformation in Cu6Sn5

Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J. and Gu, Q. F. (2011). Kinetics of the eta-eta' transformation in Cu6Sn5. Scripta Materialia, 65 (10), 922-925. doi: 10.1016/j.scriptamat.2011.07.058

The influence of topological structure on bulk glass formation in Al-based metallic glasses

Yan, M, Kohara, S., Wang, J. Q., Nogita, K., Schaffer, G. B. and Qian, M. (2011). The influence of topological structure on bulk glass formation in Al-based metallic glasses. Scripta Materialia, 65 (9), 755-758. doi: 10.1016/j.scriptamat.2011.07.009

Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5

Mu, Dekui, Read, Jonathan, Yang, Yafeng and Nogita, Kazuhiro (2011). Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5. Journal of Materials Research, 26 (20), 2660-2664. doi: 10.1557/jmr.2011.293

Granular deformation mechanisms in semi-solid alloys

Gourlay, C.M., Dahle, A. K., Nagira, T., Nakatsuka, N., Nogita, K., Uesugi, K. and Yasuda, H. (2011). Granular deformation mechanisms in semi-solid alloys. Acta Materialia, 59 (12), 4933-4943. doi: 10.1016/j.actamat.2011.04.038

In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni

Gourlay, C. M., Nogita, K., Dahle, A. K., Yamamoto, Y., Uesugi, K., Nagira, T., Yoshiya, M. and Yasuda, H. (2011). In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni. Acta Materialia, 59 (10), 4043-4054. doi: 10.1016/j.actamat.2011.03.028

The influence of solder composition on the impact strength of lead-free solder ball grid array joints

Tsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W. and Nogita, K. (2011). The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51 (3), 657-667. doi: 10.1016/j.microrel.2010.10.012

A hydrogen storage system utilising as-cast magnesium based alloys

Nogita, Kazuhiro (2011). A hydrogen storage system utilising as-cast magnesium based alloys. Ceramics Japan (Bulletin of The Ceramic Society of Japan), 46 (3), 196-200.

Eutectic modification and porosity formation in Al-Si alloys

Nogita, Kazuhiro (2011). Eutectic modification and porosity formation in Al-Si alloys. Journal of Japan Foundry Engineering Society, 83 (2), 167-175.

Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-ray

Yasuda, H., Nogita, Kazuhiro, Yamamoto, Y., Nagira, T., Yoshiya, M., Uesugi, K., Umetani, K., Takeuchi, A. and Suzuki, Y. (2011). Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-ray. Journal of the Japan Institute of Light Metals, 61 (12), 736-742.

Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?

野北 和宏 [Nogita, Kazuhiro] (2010). Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?. エレクトロニクスの実装技術 (Erekutoronikusu no Jissō-Gijutsu) [Electronic Packaging Technology], 26 (11), 20-26.

Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

Tsukamoto, H., Nishimura, T., Suenaga, S. and Nogita, K. (2010). Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates. Materials Science and Engineering B, 171 (1-3), 162-171. doi: 10.1016/j.mseb.2010.03.092

The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5

Schwingenschlogl, U., Di Paola, C., Nogita, K. and Gourlay, C. M. (2010). The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5. Applied Physics Letters, 96 (6) 061908, 061908-1-061908-3. doi: 10.1063/1.3310019

The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloys

Nogita, K, Yasuda, H, Yoshiya, M, McDonald, SD, Takeuchi, A and Suzuki, Y (2010). The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloys. Journal of Alloys and Compounds, 489 (2), 415-420. doi: 10.1016/j.jallcom.2009.09.138

Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys

Gourlay, C. M., Nogita, K., Read, J. and Dahle, A. K. (2010). Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys. Journal of Electronic Materials, 39 (1), 56-69. doi: 10.1007/s11664-009-0962-5

Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

Nogita, Kazuhiro (2010). Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. Intermetallics, 18 (1), 145-149. doi: 10.1016/j.intermet.2009.07.005

Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints

Nogita, Kazuhiro, Yasuda, Hideyuki, Gourlay, Christopher M., Suenaga, Shoichi, Tsukamoto, Hideaki, McDonald, Stuart D., Takeuchi, Akihisa, Uesugi, Kentaro and Suzuki, Yoshio (2010). Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints. Transactions of The Japan Institute of Electronics Packaging, 3 (1), 40-46.

The performance of lead-free solders during a long-distance electric vehicle race

Nogita, Kazuhiro, Greaves, Mathew C., Guymer, Benjamin D., Walsh, Bernard B., Kennedy, James M., Duke, Michael D. and Nishimura, Tetsuro (2010). The performance of lead-free solders during a long-distance electric vehicle race. Transactions of The Japan Institute of Electronics Packaging, 3 (1), 104-109.

Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface

Tsukamoto, H, Nishimura, T and Nogita, K (2009). Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface. MATERIALS LETTERS, 63 (30), 2687-2690. doi: 10.1016/j.matlet.2009.09.041

In-situ observation of Sn alloy solidification at SPring8

Yasuda, Hideyuki, Nogita, Kazuhiro, Gourlay, Christopher, Yoshiya, Masato and Nagira, Tomoya (2009). In-situ observation of Sn alloy solidification at SPring8. Journal of the Japan Welding Society, 78 (7), 6-9. doi: 10.2207/jjws.78.600

Engineering the Mg-Mg2Ni eutectic transformation to produce improved hydrogen storage alloys

Nogita, K., Ockert, S., Pierce, J., Greaves, M.C., Gourlay, C.M. and Dahle, A.K. (2009). Engineering the Mg-Mg2Ni eutectic transformation to produce improved hydrogen storage alloys. PERGAMON-ELSEVIER SCIENCE LTD, 34 (18), 7686-7691. doi: 10.1016/j.ijhydene.2009.07.036

Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substrates

Tsukamoto, Hideaki, Dong, Zhigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2009). Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substrates. Materials Science and Engineering B, 164 (1), 44-50. doi: 10.1016/j.mseb.2009.06.013

Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

Nogita, Kazuhiro, Gourlay, C. M and Nishimura, T (2009). Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates. JOM (A publication of The Minerals, Metals & Materials Society), 61 (6), 45-51. doi: 10.1007/s11837-009-0087-6

Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders

Nogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009). Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 (1), 46-54.

Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolution

Shea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng. Shiang, Sweatman, Keith and Nogita, Kazuhiro (2008). Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolution. Printed Circuit Design & Fab, 25 (10), 35-38.

Effects of boron on microstructure in cast titanium alloys

Bermingham, M., McDonald, S.D., Nogita, K., St John, D.H. and Dargusch, M.S. (2008). Effects of boron on microstructure in cast titanium alloys. Scripta Materialia, 59 (5), 538-541. doi: 10.1016/j.scriptamat.2008.05.002

Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloys

Nogita, K. and Nishimura, T. (2008). Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloys. Scripta Materialia, 59 (2), 191-194. doi: 10.1016/j.scriptamat.2008.03.002

Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder

Nogita, K., Gourlay, C., Read, J., Nishimura, T., Suenaga, S. and Dahle, A.K. (2008). Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49 (3), 443-448. doi: 10.2320/matertrans.MBW200713

The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi

Ventura, Tina, Gourlay, Christopher M., Nogita, Kazuhiro, Nishimura, Tetsuro, Rappaz, Michel and Dahle, Arne K. (2008). The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi. Journal of Electronic Materials, 37 (1), 32-39. doi: 10.1007/s11664-007-0281-7

The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys

Gourlay, C., Read, J., Nogita, K. and Dahle, A.K. (2008). The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys. Journal of Electronic Materials, 37 (1), 51-60. doi: 10.1007/s11664-007-0248-8

Ultrahigh electron emissive carbon nanotubes with nano-sized RuO2 particles deposition

Knibbe, Ruth, Nogita, Kazuhiro, Drennan, John, Noguchi, Tsuneyuki, Tatenuma, Katsuyoshi, Liu, Pou, Arai, Fumihito, Yashima, Eiji, Nishiwaki, Michiru and Kato, Shigeki (2007). Ultrahigh electron emissive carbon nanotubes with nano-sized RuO2 particles deposition. Journal of Nanoparticle Research, 9 (6), 1201-1204. doi: 10.1007/s11051-006-9207-1

A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu

Gourlay, CM, Nogita, K, McDonald, SD, Nishimura, T, Sweatman, K and Dahle, AK (2006). A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu. Scripta Materialia, 54 (9), 1557-1562. doi: 10.1016/j.scriptamat.2006.01.025

Determination of strontium segregation in modified hypoeutectic Al-Si alloy by micro X-ray fluorescence analysis

Nogita, K, Yasuda, H, Yoshida, K, Uesugi, K, Takeuchi, A, Suzuki, Y and Dahle, AK (2006). Determination of strontium segregation in modified hypoeutectic Al-Si alloy by micro X-ray fluorescence analysis. Scripta Materialia, 55 (9), 787-790. doi: 10.1016/j.scriptamat.2006.07.029

Eutectic grain size and strontium concentration in hypoeutectic aluminium-silicon alloys

McDonald, S. D., Nogita, K. and Dahle, A. K. (2006). Eutectic grain size and strontium concentration in hypoeutectic aluminium-silicon alloys. Journal of Alloys and Compounds, 422 (1-2), 184-191. doi: 10.1016/j.jallcom.2005.11.070

Influence of calcium on the microstructure and properties of an Al-7Si-0.3Mg-xFe alloy

Kumari, SSS, Pillai, RM, Nogita, K, Dahle, AK and Pai, BC (2006). Influence of calcium on the microstructure and properties of an Al-7Si-0.3Mg-xFe alloy. Metallurgical And Materials Transactions A-Physical Metallurgy And Materials Science, 37A (8) 2581, 2581-2587. doi: 10.1007/BF02586230

The effect of aluminium content on the mechanical properties and microstructure of die cast binary magnesium-aluminium alloys

Dargusch, M. S., Pettersen, K., Nogita, K., Nave, M. D. and Dunlop, G. L. (2006). The effect of aluminium content on the mechanical properties and microstructure of die cast binary magnesium-aluminium alloys. Materials Transactions, 47 (4), 977-982. doi: 10.2320/matertrans.47.977

Eutectic modification and microstructure development in Al-Si alloys

Dahle, A. K., Nogita, K., McDonald, S. D., Dinnis, C. M. and Lu, L. (2005). Eutectic modification and microstructure development in Al-Si alloys. Materials Science And Engineering A-structural Materials Properties Microstructure And Processing, 413-414 (International Conference on Advances in Solidification Processes), 243-248. doi: 10.1016/j.msea.2005.09.055

Combining Sr and Na additions in hypoeutectic Al-Si foundry alloys

Lu, L, Nogita, K and Dahle, AK (2005). Combining Sr and Na additions in hypoeutectic Al-Si foundry alloys. Materials Science And Engineering A-Structural Materials Properties Microstructure And Processing, 399 (1-2), 244-253. doi: 10.1016/j.msea.2005.03.091

Influence of microstructure of tungsten on solid state reaction rate with amorphous carbon film

Hatano, Y., Takamori, M., Nogita, K., Matsuda, K., Ikeno, S. and Watanabe, K. (2005). Influence of microstructure of tungsten on solid state reaction rate with amorphous carbon film. Journal of Nuclear Materials, 337-39 (1-3), 902-906. doi: 10.1016/j.jnucmat.2004.10.098

Microstructure control in Sn-0.7mass%Cu alloys

Nogita, Kazuhiro, Read, Jonathan, Nishimura, Tetsuro, Sweatman, Keith, Suenaga, Shoichi and Dahle, Arne K. (2005). Microstructure control in Sn-0.7mass%Cu alloys. Materials Transactions, 46 (11), 2419-2425. doi: 10.2320/matertrans.46.2419

Modification of Al-Si alloys

Nogita, K., Schaffer, P. L., McDonald, S. D., Lu, L. and Dahle, A. K. (2005). Modification of Al-Si alloys. Aluminium, 81 (4), 330-335.

Erratum: Eutectic Solidification of Al-Si Alloys (Metallurgical and Materials Transactions A (2003), 34A (2690-2693))

Dahle, A. K., McDonald, S. D. and Nogita, K. (2004). Erratum: Eutectic Solidification of Al-Si Alloys (Metallurgical and Materials Transactions A (2003), 34A (2690-2693)). Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 35 A (3)

Aluminium phosphide as a eutectic grain nucleus in hypoeutectic Al-Si alloys

Nogita, K, McDonald, SD, Tsujimoto, K, Yasuda, K and Dahle, AK (2004). Aluminium phosphide as a eutectic grain nucleus in hypoeutectic Al-Si alloys. Journal of Electron Microscopy, 53 (4), 361-369. doi: 10.1093/jmicro/dfh048

Crystallography of zirconium hydrides in recrystallized Zircaloy-2 fuel cladding lay electron backscatter diffraction

Une, K, Nogita, K, Ishimoto, S and Ogata, K (2004). Crystallography of zirconium hydrides in recrystallized Zircaloy-2 fuel cladding lay electron backscatter diffraction. Journal of Nuclear Science And Technology, 41 (7), 731-740. doi: 10.3327/jnst.41.731

Eutectic modification of Al-Si alloys with rare earth metals

Nogita, K, McDonald, SD and Dahle, AK (2004). Eutectic modification of Al-Si alloys with rare earth metals. Materials Transactions, 45 (2), 323-326. doi: 10.2320/matertrans.45.323

Eutectic nucleation in Al-Si alloys

McDonald, S. D., Nogita, K. and Dahle, A. K. (2004). Eutectic nucleation in Al-Si alloys. Acta Materialia, 52 (14), 4273-4280. doi: 10.1016/j.actamat.2004.05.043

Eutectic solidification and its role in casting porosity formation

Lu, L, Nogita, K, McDonald, SD and Dahle, AK (2004). Eutectic solidification and its role in casting porosity formation. JOM (A publication of The Minerals, Metals & Materials Society), 56 (11), 52-58. doi: 10.1007/s11837-004-0254-8

Grain size measurements in Mg-Al high pressure die castings using electron back-scattered diffraction (EBSD)

Bowles, A. L., Nogita, K., Dargusch, M. S., Davidson, C. and Griffiths, J. (2004). Grain size measurements in Mg-Al high pressure die castings using electron back-scattered diffraction (EBSD). Materials Transactions, 45 (11), 3114-3119. doi: 10.2320/matertrans.45.3114

Microstructure and mechanical properties of high pressure die cast magnesium alloy AE42 with 1% strontium

Dargusch, MS, Pettersen, K, Bakke, P, Nogita, K, Bowles, AL and Dunlop, GL (2004). Microstructure and mechanical properties of high pressure die cast magnesium alloy AE42 with 1% strontium. International Journal of Cast Metals Research, 17 (3), 170-173. doi: 10.1179/136404604225017555

Modification of Al-Si alloys

Nogita, K., McDonald, S. D. and Dahle, A. K. (2004). Modification of Al-Si alloys. Materials Forum - Aluminium Alloys Their Physical and Mechanical Properties, 28, 945-950.

Porosity formation and eutectic modification mechanism of hypoeutectic Al-SI alloys

Nogita, K. and Dahle, A. K. (2004). Porosity formation and eutectic modification mechanism of hypoeutectic Al-SI alloys. Journal of Japan Institute of Light Metals, 54 (10), 440-446. doi: 10.2464/jilm.54.440

Solidification mechanisms of unmodified and strontium-modified hypereutectic aluminium-silicon alloys

Nogita, K., McDonald, S. D. and Dahle, A. K. (2004). Solidification mechanisms of unmodified and strontium-modified hypereutectic aluminium-silicon alloys. Philosophical Magazine, 84 (17), 1683-1696. doi: 10.1080/14786430310001659803

Effects of boron on eutectic modification of hypoeutectic Al-Si alloys

Nogita, K. and Dahle, A. K. (2003). Effects of boron on eutectic modification of hypoeutectic Al-Si alloys. Scripta Materialia, 48 (3), 307-313. doi: 10.1016/S1359-6462(02)00381-0

Effects of boron-strontium interactions on eutectic modification in Al-10 mass%Si alloys

Nogita, K, McDonald, SD and Dahle, AK (2003). Effects of boron-strontium interactions on eutectic modification in Al-10 mass%Si alloys. Materials Transactions, 44 (4), 692-695. doi: 10.2320/matertrans.44.692

Evaluation of silicon twinning in hypo-eutectic Al-Si alloys

Nogita, K., Drennan, J. and Dahle, A. K. (2003). Evaluation of silicon twinning in hypo-eutectic Al-Si alloys. Materials Transactions, 44 (4), 625-628. doi: 10.2320/matertrans.44.625

Response to Discussion of 'Eutectic modification of Al-Si alloys'

Dahle, A. K., McDonald, S. D. and Nogita, K. (2003). Response to Discussion of 'Eutectic modification of Al-Si alloys'. Metallurgical And Materials Transactions A-Physical Metallurgy And Materials Science, 34A (11), 2690-2693. doi: 10.1007/s11661-003-0031-2

Columnar to equiaxed transition of eutectic in hypoeutectic aluminium-silicon alloys

Heiberg, G., Nogita, K., Dahle, A. K. and Arnberg, L. (2002). Columnar to equiaxed transition of eutectic in hypoeutectic aluminium-silicon alloys. Acta Materialia, 50 (10), 2537-2546. doi: 10.1016/S1359-6454(02)00081-2

Effect of magnesium, iron and copper on eutectic solidification of hypoeutectic aluminium-silicon alloys

Heiberg, G., Nogita, K., Raanes, M., Dons, A. L., Dahle, A. K. and Arnberg, L. (2002). Effect of magnesium, iron and copper on eutectic solidification of hypoeutectic aluminium-silicon alloys. Transactions of the American Foundrymen's Society, 110, 347-358.

Eutectic nucleation and growth in hypoeutectic Al-SI alloys at different strontium levels

Dahle, A. K., Nogita, K., Zindel, J. W., McDonald, S. D. and Hogan, L. M. (2001). Eutectic nucleation and growth in hypoeutectic Al-SI alloys at different strontium levels. Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science 35A, 32 (4) 352, 949-960. doi: 10.1007/s11661-001-0352-y

Determination of eutectic solidification mode in Sr-modified hypoeutectic Al-Si alloys by EBSD

Nogita, K and Dahle, AK (2001). Determination of eutectic solidification mode in Sr-modified hypoeutectic Al-Si alloys by EBSD. Materials Transactions Jim, 42 (2), 207-214. doi: 10.2320/matertrans.42.207

Eutectic growth mode in strontium, antimony and phosphorus modified hypoeutectic Al-Si foundry alloys

Nogita, K and Dahle, AK (2001). Eutectic growth mode in strontium, antimony and phosphorus modified hypoeutectic Al-Si foundry alloys. Materials Transactions, 42 (3), 393-396. doi: 10.2320/matertrans.42.393

Eutectic solidification in hypoeutectic Al-Si alloys: electron backscatter diffraction analysis

Nogita, K and Dahle, AK (2001). Eutectic solidification in hypoeutectic Al-Si alloys: electron backscatter diffraction analysis. Materials Characterization, 46 (4), 305-310. doi: 10.1016/S1044-5803(00)00109-1

Eutectic solidification mode in sodium modified Al-7 mass %Si-3.5 mass %Cu-0.2 mass %Mg casting alloys

Nogita, K., McDonald, S. D., Zindel, J. W. and Dahle, A. K. (2001). Eutectic solidification mode in sodium modified Al-7 mass %Si-3.5 mass %Cu-0.2 mass %Mg casting alloys. Materials Transactions, 42 (9), 1981-1986. doi: 10.2320/matertrans.42.1981

Irradiation-induced microstructure change and fuel performance of high burn-up LWR fuels

Kashibe, S., Nogita, K. and Une, K. (2001). Irradiation-induced microstructure change and fuel performance of high burn-up LWR fuels. Journal of Nuclear Science and Technology, 288, 280-280.

Mechanisms of eutectic solidification in Al-Si alloys modified with Ba, Ca, Y and Yb

Nogita, K., Knuutinen, A., McDonald, S. D. and Dahle, A. K. (2001). Mechanisms of eutectic solidification in Al-Si alloys modified with Ba, Ca, Y and Yb. Journal of Light Metals, 1 (4), 219-228. doi: 10.1016/S1471-5317(02)00005-6

Modification of Al-Si alloys with Ba, Ca, Y and Yb

Knuutinen, A., Nogita, K., McDonald, S. D. and Dahle, A. K. (2001). Modification of Al-Si alloys with Ba, Ca, Y and Yb. Journal of Light Metals, 1 (4), 229-240. doi: 10.1016/S1471-5317(02)00004-4

Porosity formation in aluminium alloy A356 modified with Ba, Ca, Y and Yb

Knuutinen, A., Nogita, K., McDonald, S. D. and Dahle, A. K. (2001). Porosity formation in aluminium alloy A356 modified with Ba, Ca, Y and Yb. Journal of Light Metals, 1 (4), 241-249. doi: 10.1016/S1471-5317(02)00006-8

Rim structure formation of isothermally irradiated UO2 fuel discs

Une, K., Nogita, K., Shiratori, T. and Hayashi, K. (2001). Rim structure formation of isothermally irradiated UO2 fuel discs. Journal of Nuclear Materials, 288 (1), 20-28. doi: 10.1016/S0022-3115(00)00712-1

Thermal conductivities of irradiated UO2 and (U,Gd)O-2

Minato, K., Shiratori, T., Serizawa, H., Hayashi, K., Une, K., Nogita, K., Hirai, M. and Amaya, M. (2001). Thermal conductivities of irradiated UO2 and (U,Gd)O-2. Journal of Nuclear Materials, 288 (1), 57-65. doi: 10.1016/S0022-3115(00)00578-X

Rim structure formation and high burnup fuel behavior of large-grained UO2 fuels

Une, K., Hirai, M., Nogita, K., Hosokawa, T., Suzawa, Y., Shimizu, S. and Etoh, Y. (2000). Rim structure formation and high burnup fuel behavior of large-grained UO2 fuels. Journal of Nuclear Materials, 278 (1), 54-63. doi: 10.1016/S0022-3115(99)00214-7

Depth profiles of damage accumulation in UO2 and (U,Gd)O2 pellets irradiated with 100 MeV iodine

Nogita, K., Hayashi, K., Une, K. and Fukuda, K. (1999). Depth profiles of damage accumulation in UO2 and (U,Gd)O2 pellets irradiated with 100 MeV iodine. Journal of Nuclear Materials, 273 (3), 302-309. doi: 10.1016/S0022-3115(99)00048-3

High resolution TEM observation and density estimation of Xe bubbles in high burnup UO2 fuels

Nogita, K. and Une, K. (1998). High resolution TEM observation and density estimation of Xe bubbles in high burnup UO2 fuels. Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms, 141 (1-4), 481-486. doi: 10.1016/S0168-583X(98)00040-8

Effect of grain size on recrystallization in high burnup fuel pellets

Nogita, K., Une, K., Hirai, M., Ito, K., Ito, K. and Shirai, Y. (1997). Effect of grain size on recrystallization in high burnup fuel pellets. Journal of Nuclear Materials, 248, 196-203. doi: 10.1016/S0022-3115(97)00156-6

Formation of pellet-cladding bonding layer in high burnup BWR fuels)

Nogita, Kazuhiro and Une, Katsumi (1997). Formation of pellet-cladding bonding layer in high burnup BWR fuels). Journal of Nuclear Science and Technology, 34 (7), 679-686. doi: 10.1080/18811248.1997.9733726

High resolution TEM of high burnup UO2 fuel

Nogita, K. and Une, K. (1997). High resolution TEM of high burnup UO2 fuel. Journal of Nuclear Materials, 250 (2-3), 244-249. doi: 10.1016/S0022-3115(97)00282-1

TEM analysis of pellet-cladding bonding layer in high burnup BWR fuel

Nogita, K., Une, K. and Korei, Y. (1996). TEM analysis of pellet-cladding bonding layer in high burnup BWR fuel. Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms, 116 (1-4), 521-526. doi: 10.1016/0168-583X(96)00100-0

Corrosion behavior of unirradiated oxide fuel pellets in high temperature water

Une, K., Kashibe, S. and Nogita, K. (1995). Corrosion behavior of unirradiated oxide fuel pellets in high temperature water. Journal of Nuclear Materials, 227 (1-2), 32-39. doi: 10.1016/0022-3115(95)00141-7

Irradiation-induced recrystallization in high burnup UO2 fuel

Nogita, K. and Une, K. (1995). Irradiation-induced recrystallization in high burnup UO2 fuel. Journal of Nuclear Materials, 226 (3), 302-310. doi: 10.1016/0022-3115(95)00123-9

Radiation-induced microstructural change in high burnup UO2 fuel pellets

Nogita, K. and Une, K. (1994). Radiation-induced microstructural change in high burnup UO2 fuel pellets. Nuclear Inst. and Methods in Physics Research, B, 91 (1-4), 301-306. doi: 10.1016/0168-583X(94)96235-9

Effect of Grain Size on Microstructural Change and Damage Recovery in UO2 Fuels Irradiated to 23 GWd/t

Nogita, Kazuhiro and Une, Katsumi (1994). Effect of Grain Size on Microstructural Change and Damage Recovery in UO2 Fuels Irradiated to 23 GWd/t. Journal of Nuclear Science and Technology, 31 (9), 929-936. doi: 10.1080/18811248.1994.9735243

Effect of Grain Size on Microstructural Change and Damage Recovery in UO2Fuels Irradiated to 23GWd/t

Nogita, Kazuhiro and Une, Katsumi (1994). Effect of Grain Size on Microstructural Change and Damage Recovery in UO2Fuels Irradiated to 23GWd/t. Journal of Nuclear Science and Technology, 31 (9), 929-936. doi: 10.3327/jnst.31.929

Formation and growth of intragranular fission gas bubbles in UO2 fuels with burnup of 6-83 GWd/t

Kashibe, S., Une, K. and Nogita, K. (1993). Formation and growth of intragranular fission gas bubbles in UO2 fuels with burnup of 6-83 GWd/t. Journal of Nuclear Materials, 206 (1), 22-34. doi: 10.1016/0022-3115(93)90229-R

Thermal Recovery of Radiation Defects and Microstructural Change in Irradiated UO2 Fuels

Nogita, Kazuhiro and Une, Katsumi (1993). Thermal Recovery of Radiation Defects and Microstructural Change in Irradiated UO2 Fuels. Journal of Nuclear Science and Technology, 30 (9), 900-910. doi: 10.3327/jnst.30.900

Thermal recovery of radiation defects and microstructural change in irradiated UO2fuels

Nogita, Kazuhiro and Une, Katsumi (1993). Thermal recovery of radiation defects and microstructural change in irradiated UO2fuels. Journal of Nuclear Science and Technology, 30 (9), 900-910. doi: 10.1080/18811248.1993.9734564

Microstructural change and its influence on fission gas release in high burnup UO2 fuel

Une, K., Nogita, K., Kashibe, S. and Imamura, M. (1992). Microstructural change and its influence on fission gas release in high burnup UO2 fuel. Journal of Nuclear Materials, 188 (C), 65-72. doi: 10.1016/0022-3115(92)90455-T

Controlling porosity during transient liquid phase bonding for high-temperature soldering processes

Abdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722

Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study

Tan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129743

The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi

Ye, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707

Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations

Hari, Vigneshwar, Xu, Dong, McDonald, Stuart D., Tong, Zherui, Qu, Dongdong and Nogita, Kazuhiro (2023). Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations. TMS 2023 Annual Meeting & Exhibition, San Diego, CA, United States, 19-23 March 2023. Cham, Switzerland: Springer Nature Switzerland. doi: 10.1007/978-3-031-22532-1_62

Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption Process

Kim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor B. and Nogita, Kazuhiro (2022). Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption Process. 23rd Magnesium Technology Symposium at the 151st TMS Annual Meeting and Exhibition, Anaheim, CA, United States, 27 February - 3 March 2022. Cham, Switzlerland: Springer International Publishing. doi: 10.1007/978-3-030-92533-8_12

Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder

Hao, Qichao, Tan, Xin Fu, McDonald, Stuart D., Sweatman, Keith, Nishimura, Takatoshi, Nishimura, Tetsuro and Nogita, Kazuhiro (2022). Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795406

Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based solders

Somidin, Flora, Akaiwa, Tetsuya, McDonald, Stuart D., Nishimura, Tetsuro, Ye, Xiaozhou, Smith, Anthony, Zhou, Jiye and Nogita, Kazuhiro (2022). Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based solders. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795417

Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloys

Nogita, Kazuhiro, Read, Jonathan, McDonald, Stuart D., Xu, Dong and Nishimura, Tetsuro (2022). Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloys. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795610

The Independent Effects of Cooling Rate and Na Addition on Hydrogen Storage Properties in Hypo-eutectic Mg Alloys

Kim, Manjin, Ali, Yahia, McDonald, Stuart D., Abbott, Trevor B. and Nogita, Kazuhiro (2020). The Independent Effects of Cooling Rate and Na Addition on Hydrogen Storage Properties in Hypo-eutectic Mg Alloys. 149th TMS Annual Meeting & Exhibition, San Diego, CA, United States, 23-27 February 2020. Cham, Switzerland: Springer. doi: 10.1007/978-3-030-36647-6_43

Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys

Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart and Stjohn, David (2019). Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012009

Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow

Somidin, Flora, McDonald, Stuart, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012006

Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions

Somidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. NEW YORK: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733594

Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates

Abdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008

Role of Bi, Sb and in in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnections

Belyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K. and Gourlay, C. M. (2019). Role of Bi, Sb and in in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnections. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733493

Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates

Tan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007

Effect of reflow conditions on the intermetallic layer in solder joints

Nogita, K., Somidin, F., Mohd Salleh, M. A.A., Sweatman, K., Nishimura, T., McDonald, S. D., Maeno, H. and Matsumura, S. (2018). Effect of reflow conditions on the intermetallic layer in solder joints. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kuwana, Mie, Japan, 17 - 21 April 2018. Japan: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2018.8374678

Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction

Qu, Dong Dong, McDonald, Stuart D., Yasuda, Hideyuki, Ohara, Koji, Kohara, Shinji and Nogita, Kazuhiro (2018). Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.101

Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder

Xuan, Quy Tran, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart D. and Nogita, Kazuhiro (2018). Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , 1-2 November 2017 . Zurich, Switzerland : Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.9

Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce system

Wong, Charlotte, Styles, Mark J., Zhu, Suming, Abbott, Trevor, Nogita, Kazuhiro, McDonald, Stuart D., StJohn, David H., Gibson, Mark A. and Easton, Mark A. (2018). Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce system. International Symposium on Magnesium Technology, 2018, Phoenix, AZ, USA, March 11, 2018-March 15, 2018. Springer International Publishing. doi: 10.1007/978-3-319-72332-7_13

Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding

Somidin, Flora, McDonald, Stuart and Nogita, Kazuhiro (2018). Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding. Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1-2 November 2017. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.14

Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys

Tan, Xin Fu, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart and Nogita, Kazuhiro (2018). Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys. Electronic Packaging Interconnect Technology Symposium, Fukuoka, Japan, 1-2 November 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/SSP.273.20

Influence of Bi addition on wettability and mechanical properties of Sn-0.7Cu solder alloy

Ramli, M. I.I., Yusof, M. S.S., Mohd Salleh, M. A.A., Said, R. M. and Nogita, K. (2018). Influence of Bi addition on wettability and mechanical properties of Sn-0.7Cu solder alloy. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.27

Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliability

Belyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K. and Gourlay, C. M. (2018). Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliability. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, Kuwana, Mie, Japan, 17-21 April 2018. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2018.8374705

Stem analysis of atom location in (Cu, Au, Ni)6Sn5 intermetallic compounds

Yang, Wen Hui, Yamamoto, Tomokazu, Nogita, Kazuhiro and Matsumura, Syo (2018). Stem analysis of atom location in (Cu, Au, Ni)6Sn5 intermetallic compounds. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , 1-2 November 2017 . Zurich, Switzerland : Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.95

Synchrotron radiography of Sn-0.7Cu-0.05Ni solder solidification

Xian, J. W., Mohd Salleh, M. A.A., Zeng, G., Belyakov, S. A., Yasuda, H., Nogita, K. and Gourlay, C. M. (2018). Synchrotron radiography of Sn-0.7Cu-0.05Ni solder solidification. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.66

The interaction of Sn-Ga alloys and Au coated Cu substrates

Liu, Shi Qian, Qu, Dong Dong, McDonald, Stuart D. and Nogita, Kazuhiro (2018). The interaction of Sn-Ga alloys and Au coated Cu substrates. 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1 - 2 November 2017. Pfaffikon, Switzerland: Scientific.Net. doi: 10.4028/www.scientific.net/SSP.273.3

Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects

Nogita, K., Salleh, M. A. A. Mohd, Smith, S., Wu, Y. Q., McDonald, S. D., Ab Razak, A. G., Akaiwa, T. and Nishimura, T. (2017). Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects. 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Japan, 19 - 22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2017.7939399

Real time X-ray imaging of soldering processes at the SPring-8 synchrotron

Nogita, K., Salleh, M. A. A. Mohd, Zeng, G., McDonald, S. D., Gourlay, C. and Yasuda, H. (2017). Real time X-ray imaging of soldering processes at the SPring-8 synchrotron. International Conference on Electronics Packaging (ICEP), Tendo, Japan, 19-22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers . doi: 10.23919/ICEP.2017.7939343

Real-time observation of AZ91 solidification by synchrotron radiography

Zeng, G., Nogita, K., Belyakov, S., Xian, J. W., McDonald, S. D., Yang, K. V., Yasuda, H. and Gourlay, C. M. (2017). Real-time observation of AZ91 solidification by synchrotron radiography. Magnesium Technology 2017, San Diego, CA, United States, 26 February - 2 March 2017. Cham, Switzerland: Springer. doi: 10.1007/978-3-319-52392-7_82

Effects of trace phosphorus in Sn-Cu-Ni wave solder dross

Nogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49

Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%)

Belyakov, S. A., Nishimura, T., Sweatman, K., Nogita, K. and Gourlay, C. M. (2016). Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%). 2016 International Conference on Electronics Packaging, ICEP 2016, Hokkaido, Japan, 20-22 April 2016. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.1109/ICEP.2016.7486816

Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications

Smith, S., Zeng, G., Read, J., McDonald, S. D. and Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.58

Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni solders

Gourlay, C. M., Ma, Z. L., Xian, J. W., Belyakov, S. A., Mohd Salleh, M. A. A., Zeng, G., Yasuda, H. and Nogita, K. (2016). Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni solders. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.44

Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys

Nogita, K., Kefford, B., Read, J. and McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.53

XPS analysis of oxide films on lead-free solders with trace additions of germanium and gallium

Watling, K. M., Chandler-Temple, A. and Nogita, K. (2016). XPS analysis of oxide films on lead-free solders with trace additions of germanium and gallium. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.63

Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling

Prasad, A., Liotti, E., McDonald, S. D., Nogita, K., Yasuda, H., Grant, P. S. and StJohn, D. H. (2015). Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling. 14th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes, Awaji island, Hyogo, Japan, 21-26 June 2015. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/84/1/012014

The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates

Ng, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122

Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'

Nogita, Kazuhiro, Kennedy, James, Amsler, John, Greaves, Matthew, Tuesley, Cameron and Nishimura, Takatoshi (2014). Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'. 2014 International Conference on Electronics Packaging, ICEP 2014, Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826652

Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics

Zeng, Guang, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2014). Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics. 2014 International Conference on Electronics Packaging (ICEP 2014), Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826677

Crack formation and propagation mechanisms in interfacial Cu6Sn5

Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, 10-12 April 2013. Osaka, Japan: Japan Institute of Electronics Packaging (JIEP).

Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics

Zeng, Guang, McDonald, Stuart, Gu, Qinfen and Nogita, Kazuhiro (2013). Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013.

Grain refinement for improved lead-Free solder joint reliability

Sweatman, K., Mcdonald, S. D., Whitewick, M., Nishimura, T. and Nogita, K. (2013). Grain refinement for improved lead-Free solder joint reliability. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, San Diego, United States, 19-21 February 2013. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries.

New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature range

Barry, J., Yamamoto, T., Gu, Q., Huang, Yang, Matsumura, S. and Nogita, Kazuhiro (2013). New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature range. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013.

Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review

Mohd Salleh, M. A. A., McDonald, Stuart and Nogita, Kazuhiro (2013). Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review. ITMS 2013: 4th International Conference on Information Technology for Manufacturing Systems, Auckland, New Zealand, 27-29 August, 2013. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/AMM.421.260

Effect of cooling rate on the intermetallic layer in solder joints

Sweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. IPC APEX Expo 2012, San Diego, United States, 28 February - 1 March 2012. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries.

Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5

Mu, Dekui, Huang, Han and Nogita, Kazuhiro (2012). Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. TMS 2012 141st Annual Meeting and Exhibition, Orlando, United States, 11-15 March 2012.

Industry-university collaboration and advances in lead-free solder technology

Nogita, Kazuhiro (2012). Industry-university collaboration and advances in lead-free solder technology. Proc. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012.

The stability of Cu6Sn5 in the formation and performance of lead-free solder joints

Sweatman, Keith, Nishimura, T. and Nogita, Kazuhiro (2012). The stability of Cu6Sn5 in the formation and performance of lead-free solder joints. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012.

The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders

Sweatman, Keith, Read, J., Nishimura, T. and Nogita, Kazuhiro (2011). The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders. SMTA International, Fort Worth, Texas, United States, 16-20 October 2011.

Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder joints

Mu, D., Read, J., Yang, Y-F. and Nogita, K. (2011). Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder joints. International Conference on Electronic Packaging (ICEP 2011), Nara, Japan, 13-15 April 2011. Nara, Japan: The Japan Institute of Electronics Packaging.

Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS

Nogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew and McDonald, Stuart D. (2010). Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2851

Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints

Mu, Dekui, Tsukamoto, Hideaki, Huang, Han and Nogita, Kazuhiro (2010). Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, 2-6 August, 2010. Stafa-Zurich ; United Kingdom: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2450

Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racing

Nogita, K., Greaves, M., Guymer, B., Walsh, B., Kennedy, J., Duke, M. and Nishimura, T. (2010). Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racing. International Conference on Electronics Packaging 2010, Sapporo, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP).

Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface

Tsukamoto, Hideaki, Dong, Zigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2010). Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2-6 August, 2010. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2446

Trace element distribution in solder joints between Sn-based solders and Cu substrates

Nogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP).

Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni Alloys

Nogita, Kazuhiro (2009). Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni Alloys. Switzerland: Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/MSF.618-619.391

Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints

Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009.

Effect of intermetallic stabilization on the impact resistance of joints to BGA packages

Sweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro and Nishimura, Tetsuro (2009). Effect of intermetallic stabilization on the impact resistance of joints to BGA packages. 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, 9 - 11 December 2009. Piscataway, NJ United States: I E E E. doi: 10.1109/EPTC.2009.5416526

Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates

Hideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging.

Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces

Nogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging.

The Effect of Ni on Phase Stability in Cu6Sn5

Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, 15-17 September 2009.

The influence of Ni additions on the solidification of Sn-0.7%Cu solder

T. Ventura, C. M. Gourlay, K. Nogita, M. Rappaz and A. K. Dahle (2009). The influence of Ni additions on the solidification of Sn-0.7%Cu solder. Materials and AustCeram 2009 Conference, Gold Coast, Australia, 1-3 July 2009.

The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates

Nogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009.

The influence of solder composition on the impact strength of lead-free solder BGA joints

Tsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS.

Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces

Tsukamoto, H., Dong, Z., Huang, H., Nishimura, T. and Nogita, K. (2008). Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces. Materials and AustCeram Conference (MAC 2009), Gold Coast, Queensland, 1-3 July 2009.

Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys

Nogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, 23-25 September 2008.

Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMS

Simensen, C.J., Hillion, F., Nielsen, O., Nogita, K. and Dahle, A.K. (2007). Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMS. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Great Britain: Department of Engineering Materials, University of Sheffield.

Engineering eutectic solidification in Al-Si Alloys

Dahle, A.K., Nogita, K. and McDonald, S.D. (2007). Engineering eutectic solidification in Al-Si Alloys. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Sheffield, United Kingdom: University of Sheffield.

Microstructure and solidification of hypoeutectic, eutectic, and hypereutectic Mg-Mg2Ni alloys

Nogita, K. and Dahle, A.K. (2007). Microstructure and solidification of hypoeutectic, eutectic, and hypereutectic Mg-Mg2Ni alloys. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July, 2007. Sheffield, United Kingdom: Department of Engineering Materials, University of Sheffield.

New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si Alloys

Nogita, K., McDonald, S.D. and Dahle, A.K. (2007). New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si Alloys. TMS Annual Meeting, Orlando, Florida, USA, February 25 - March 1 2007. United Stated: The Minerals, Metals and Materials Society.

Refinement of Al-Si Eutectic Grains - A Novel method to produce high integrity Al-Si Alloy Castings

Lu, L., Nogita, K. and Dahle, A.K. (2007). Refinement of Al-Si Eutectic Grains - A Novel method to produce high integrity Al-Si Alloy Castings. Light Metals 2007, Orlando, Florida, USA, February 25 - March 1 2007. USA: The Minerals, Metals and Materials Society.

Solidification characteristics of lead-free solder Sn-0.7Cu-0.06Ni

Ventura, T., Nogita, K., Gourlay, C., Nishimura, T., Rappaz, M. and Dahle, A.K. (2007). Solidification characteristics of lead-free solder Sn-0.7Cu-0.06Ni. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. United Kingdom: Department of Engineering Materials, University of Sheffield.

Analytical electron microscopy of proton exchange membrane fuel cells

Drennan, John, Webb, Rick, Nogita, Kaz, Knibbe, Ruth, Auchterlonie, Graeme, Tatenuma, K. and Hunter, Jane (2006). Analytical electron microscopy of proton exchange membrane fuel cells. International Conference on Solid State Ionics, Baden-Baden, Germany, 17-22 July 2005. Amsterdam, Netherlands: Elsevier. doi: 10.1016/j.ssi.2006.07.016

Influence of microstructure of tungsten on solid state reaction rate with amorphous carbon film

Hatano, Y., Takamori, M., Nogita, K., Matsuda, K., Ikeno, S. and Watanabe, K. (2005). Influence of microstructure of tungsten on solid state reaction rate with amorphous carbon film. doi: 10.1016/j.jnucmat.2004.10.098

The role of the eutectic in porosity formation in Al-Si foundry alloys

McDonald, S. D., Lu, L., Nogita, K. and Dahle, A. K. (2005). The role of the eutectic in porosity formation in Al-Si foundry alloys. Shape Casting - The John Campbell Symposium - TMS 2005 Annual Meeting, San Francisco, California, 13-17 February 2005 .

Crystallography of zirconium hydride in zircaloy-2 nuclear fuel cladding

Une, K., Nogita, K. and Ogata, K. (2004). Crystallography of zirconium hydride in zircaloy-2 nuclear fuel cladding. Proceedings of 18th Australian Conference on Microscopy & Microanalysis, Geelong, Australia, 2-6 February 2004. Australia: Australian Microscopy and Microanalysis Society Inc.

Finding eutectic nuclei in hypoeutectic Al-Si alloys by focused ion beam milling

Nogita, K., McDonald, S. D., Tsujimoto, K., Yasuda, K. and Dahle, A. K. (2004). Finding eutectic nuclei in hypoeutectic Al-Si alloys by focused ion beam milling. Proceedings of Japan Institute of Metals Fall Meeting, Japan, 28-30 September 2004. Japan: Japan Institute of Metals.

Nucleation of eutectic silicon on aluminium phosphide in hypoeutectic Al-Si alloys

Nogita, K., Tsujimoto, K., Dahle, A. K. and Drennan, J. (2004). Nucleation of eutectic silicon on aluminium phosphide in hypoeutectic Al-Si alloys. Proceedings of 18th Australian Conference on Microscopy & Microanalysis, Geelong, Australia, 2-6 February 2004. Australia: Australian Microscopy and Microanalysis Society Inc.

Recent progress in understanding eutectic solidification in aluminium-silicon foundry alloys

Nogita, K., McDonald, S. D., Dinnis, C. M., Lu, L. and Dahle, A. K. (2004). Recent progress in understanding eutectic solidification in aluminium-silicon foundry alloys. 2004 TMS Annual Meeting and Exhibition, Charlotte, North Carolina, U.S.A., 14-18 March 2004. Warrendale, PA, U.S.A.: The Minerals, Metals and Materials Society.

Development of high performance anode catalyst for DMFC and DDFC (1) - Preparation and characterization of the catalyst

Amano, M., Shioya, K., Arai, O., Tatenuma, K., Haraguchi, T., Drennan, J. and Nogita, K. (2003). Development of high performance anode catalyst for DMFC and DDFC (1) - Preparation and characterization of the catalyst. Proceedings of Annual Meeting Electrochemical Society of Japan, Japan, 1-3 April 2003. Japan: Electrochemical Society of Japan.

Eutectic modification of hypoeutectic Al-Si alloys with rare earth metals

Nogita, K., McDonald, S. and Dahle, A. K. (2003). Eutectic modification of hypoeutectic Al-Si alloys with rare earth metals. Proceedings of Japan Institute of Metals Fall Meeting, Japan, 11-13 October 2003. Japan: Japan Institute of Metals.

Highly functional carbon materials impregnated with nano-size RuO2 particle

Tatenuma, K., Noguchi, T., Amano, M., Taguchi, T., Nogita, K., Drennan, J., Mori, T. and Miyazawa, K. (2003). Highly functional carbon materials impregnated with nano-size RuO2 particle. UK - Japan workshop on Nano Science for Energy and Environmenn, Scotland, UK, 11 September 2003. Japan: Japan Society.

Application of SEM/EBSD and FEG-TEM/CBED to determine eutectic solidificaation mechanisms

Nogita, K., Dahle, A. K. and Drennan, J. (2002). Application of SEM/EBSD and FEG-TEM/CBED to determine eutectic solidificaation mechanisms. The 17th International Conference of Australian Society for Ey, Adelaide Convention Center, Adelaide, South Australia, 4-8 February 2002.

Effects of boron on eutectic modification of hypoeutectic Al-Si alloys

Nogita, K., McDonald, S. D. and Dahle, A. K. (2002). Effects of boron on eutectic modification of hypoeutectic Al-Si alloys. 2002 Japan Institute of Metals Fall Meeting, Osaka University, Osaka, Japan, 2-4 November, 2002. Sendai, Japan: Japan Institute of Metals.

Eutectic solidification in hypoeutectic Al-Si alloys and its effect on porosity

Dahle, A. K., McDonald, S. D. and Nogita, K. (2002). Eutectic solidification in hypoeutectic Al-Si alloys and its effect on porosity. The 17th International Conference of Australian Society for Ey, Materials Solutions 2002, Columbus, OH, USA, 7-9 October 2002. Materials Park, OH 44073-0002, USA: ASM International, Member/Customer Service Center.

Application of EBSD and TEM to determine eutectic solidification mechanisms

Nogita, K., Dahle, A. K. and Drennan, J. (2001). Application of EBSD and TEM to determine eutectic solidification mechanisms. Japan Institute of Metals Fall Meeting, Japan, 21-23 Sept 2001. Japan: The Japan Institute of Metals.

Eutectic modification and castability of hypoeutective Al-Si alloys

Nogita, K., Couper, M. J. and Dahle, A. K. (2001). Eutectic modification and castability of hypoeutective Al-Si alloys. Japan Institute of Metals Fall Meeting, Japan, 21-23 Sept 2001. Japan: The Japan Institute of Metals.

Solidification of the eutectic in hypoeutectic Al-Si alloys

Nogita, K. and Dahle, A. K. (2001). Solidification of the eutectic in hypoeutectic Al-Si alloys. Engineering Materials 2001, Melbourne, Australia, 23-26 Sept 2001. Melbourne, Australia: The Institute of Materials Engineering, Australia Ltd.

Understanding eutectic formation in hypoeutectic Al-Si alloys

Dahle, A. K., Nogita, K., McDonald, S. and Zindel, J. W. (2001). Understanding eutectic formation in hypoeutectic Al-Si alloys. TMS 130th Annual Int. Meeting & Exhibition, New Orleans, USA, 11-15 Feb 2001. USA: TMS.

Determination of eutectic solidification mode in Sr-modified hypoeutectic Al-Si alloys by EBSD

Nogita, K. and Dahle, A. K. (2000). Determination of eutectic solidification mode in Sr-modified hypoeutectic Al-Si alloys by EBSD. TMS Fall Meeting, St Louis, MI, USA, 3-6 October 2000. Warrendale, PA, USA: The Minerals, Metals & Materials Society.

EBSD analysis of eutectic solidification in Al-Si alloys

Nogita, K., Dahle, A. K., Hogan, L. M. and Drennan, J. (2000). EBSD analysis of eutectic solidification in Al-Si alloys. MicroOZcopy 2000, Canberra, Australia, 6-11 February 2000. Canberra, Australia:

Eutectic growth mode in strontium, antimony and phosphorous modified Al-Si foundry alloys

Nogita, K. and Dahle, A. K. (2000). Eutectic growth mode in strontium, antimony and phosphorous modified Al-Si foundry alloys. JIM Fall Meeting, Nagoya, Japan, 1-3 October 2000. Japan: Japanese Institute of Metals.

Eutectic solidification and porosity formation in Al-Si alloys: the role of strontium

McDonald, S., Nogita, K., Dahle, A. K., Taylor, J. A. and St John, D. H. (2000). Eutectic solidification and porosity formation in Al-Si alloys: the role of strontium. 104th AFS Casting Congress, Pittsburgh, PA, USA, 8-11 April 2000. Des Plaines, Illinois, USA: American Foundrymen's Society.

Specimen preparation for electron backscatter diffraction (EBSD) analysis of aluminimum silicon cast alloys, electro polishing versus fast atom bombardment (FAB)

Guldbrandsen-Dahl, S., Heiberg, G., Hjelen, J., Nogita, K., Raanes, M. and Dahle, A. K. (2000). Specimen preparation for electron backscatter diffraction (EBSD) analysis of aluminimum silicon cast alloys, electro polishing versus fast atom bombardment (FAB). 12th European Congress on Electron Microscopy (EUREM 12), Brno, Czech Republic, 9-14 July 2000. Brno, Czech Republic: Czechoslovak Society for Electron Microscopy.